Contributions are from world wide research leaders
Comprehensive in scope
Each chapter focuses on a single issue and addresses the current understanding of the subject, the problems that still need to be tackled and suggestions for potential approaches to do so
Includes supplementary material: sn.pub/extras
Buy it now
Tax calculation will be finalised at checkout
Other ways to access
This is a preview of subscription content, access via your institution.
Table of contents (23 chapters)
About this book
In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, till recently, solders used in electronics, remained lead-based.
The worldwide multi-facetted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in these many different sources, so it becomes essential to have most of the relevant and currently available information presented in a single publication. With this goal in mind the important issues encountered in the lead-free electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas were invited to write articles on those topics. They were asked to address the importance of a given issue, the current status of understanding and available solutions, the problems that still need to be tackled and suggestions for potential approaches to do so.
The chapters are organized around the following subject areas: themodynamics and phase diagrams, solder developments, processing issues, mechanical property considerations, effects of thermal excursions (TMF), electromigraion, whisker growth, tin pest, and industrial perspectives (consumer electronics, and high-end high reliability applications).
This material originally appeared in a special issue of Journal of Materials Science: Materials in Electronics. Because this journal may not be a regular source of scientific information for academic researchers in fields other than Materials Science and those in industry, and to provide wider awareness of the current status of lead-free electronic solders to those persons active in the area but who are not regular readers of the Journal, these articles are being reprinted in book form.
- lead-free solders
- mechanical engineering
- microelectronics packaging
- solder joint reliability
- quality control, reliability, safety and risk
From the reviews:
"The main part of the text is devoted to soldering materials with all the most common alloys illustrated and supported with mechanical data and phase diagrams. … there is a lot of real value on the informative to research and process engineers who want to go deeper into the subject." (Bob Willis, Electronics Production World, August, 2007)
Authors and Affiliations
Chemical Engineering & Materials Science, Michigan State University, East Lansing
K. N. Subramanian
Book Title: Lead-Free Electronic Solders
Book Subtitle: A Special Issue of the Journal of Materials Science: Materials in Electronics
Authors: K. N. Subramanian
Publisher: Springer New York, NY
Copyright Information: Springer-Verlag US 2007
Hardcover ISBN: 978-0-387-48431-0Published: 30 April 2007
Softcover ISBN: 978-1-4419-4302-6Published: 04 November 2010
eBook ISBN: 978-0-387-48433-4Published: 28 June 2007
Edition Number: 1
Number of Pages: VI, 378
Topics: Electronics and Microelectronics, Instrumentation, Materials Science, general, Metallic Materials, Quality Control, Reliability, Safety and Risk, Mechanical Engineering, Optical and Electronic Materials