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Mechanics of Microelectronics

  • G. Q. Zhang
  • W. D. Van Driel
  • X. J. Fan

Part of the Solid mechanics and its applications book series (SMIA, volume 141)

Table of contents

  1. Front Matter
    Pages i-xiii
  2. A. J. van Roosmalen
    Pages 1-34
  3. F. G. Kuper, X. J. Fan
    Pages 35-63
  4. H. J. Eggink, J. H. J. Janssen
    Pages 65-94
  5. J. Zhou, G. Q. Zhang
    Pages 95-167
  6. W. D. van Driel, G. Q. Zhang, X. J. Fan
    Pages 169-279
  7. X. J. Fan, G. Q. Zhang, W. D. van Driel, J. Zhou
    Pages 281-375
  8. G. Q. Zhang, N. Tzannetakis, W. D. van Driel
    Pages 469-536
  9. G. Q. Zhang
    Pages 537-563
  10. Back Matter
    Pages 565-571

About this book

Introduction

From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research.

Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Keywords

Computer-Aided Design (CAD) Simulation design development electronic packaging mechanical engineering mechanics microelectronics modeling optimization reliability stability statistics thermo-mechanics virtual prototyping

Editors and affiliations

  • G. Q. Zhang
    • 1
  • W. D. Van Driel
    • 1
  • X. J. Fan
    • 2
  1. 1.Philips Semiconductors and Delft University of TechnologyThe Netherlands
  2. 2.Intel CorporationUSA

Bibliographic information

  • DOI https://doi.org/10.1007/1-4020-4935-8
  • Copyright Information Springer 2006
  • Publisher Name Springer, Dordrecht
  • eBook Packages Engineering
  • Print ISBN 978-1-4020-4934-7
  • Online ISBN 978-1-4020-4935-4
  • Series Print ISSN 0925-0042
  • Buy this book on publisher's site