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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

  • E. Suhir
  • Y. C. Lee
  • C. P. Wong

Table of contents

  1. Front Matter
    Pages i-xxxi
  2. Materials Physics

    1. Front Matter
      Pages A1-A1
    2. L. J. Ernst, K. M. B. Jansen, D. G. Yang, C. van ’t Hof, H. J. L. Bressers, J. H. J. Janssen et al.
      Pages A3-A63
    3. Avram Bar-Cohen, Bongtae Han, Kyoung Joon Kim
      Pages A65-A110
    4. Claire Gu, Yisi Liu, Yuan Xu, J. J. Pan, Fengqing Zhou, Liang Dong et al.
      Pages A111-A134
    5. A. Wymysłowski, G. Q. Zhang, W. D. van Driel, L. J. Ernst
      Pages A205-A266
  3. Materials Mechanics

    1. Front Matter
      Pages A267-A267
    2. Toni T. Mattila, Tomi T. Laurila, Jorma K. Kivilahti
      Pages A313-A350
    3. Jin Liang, Nader Dariavach, Dongkai Shangguan
      Pages A351-A409
    4. Masaki Shiratori, Qiang Yu
      Pages A411-A427
    5. John H. L. Pang
      Pages A429-A458
    6. Dov Ingman, Tatiana Mirer, Ephraim Suhir
      Pages A571-A594
  4. Physical Design

  5. Reliability and Packaging

    1. Front Matter
      Pages B175-B175
    2. H. Anthony Chan
      Pages B177-B201
    3. Sridhar Canumalla, Puligandla Viswanadham
      Pages B253-B298
    4. Y. C. Lee
      Pages B299-B322
    5. Ryszard J. Pryputniewicz
      Pages B323-B340
    6. P. Misselbrook, D. Gwyer, C. Bailey, P. P. Conway, K. Williams
      Pages B361-B382
    7. Anne-Claire Pliska, Christian Bosshard
      Pages B487-B525
    8. James E. Morris, Johan Liu
      Pages B527-B570
    9. Johann Nicolics, Martin Mündlein
      Pages B571-B610
    10. Márta Rencz, Vladimir Székely, Bernard Courtois
      Pages B629-B650
    11. Enboa Wu, Shoulung Chen, C. Z. Tsai, Nicholas Kao
      Pages B651-B676
    12. Li Li, Yifan Guo, Dawei Zheng
      Pages B677-B709

About this book

Introduction

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices.   Furthermore,  practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices.  The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.

Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.

Topics addressed in the book include, but are not limited to, the following:

physics and mechanics of polymer materials;

underfills;

electrically conductive adhesives;

plastic packages of IC devices;

flip-chip packages;

wirebond interconnects and metallurgical interconnections for harsh environments;

reliability and stress testing and accelerated life testing;

solder joint materials and technologies as well as  lead-free solder materials and joints;

reliability of mobile electronic products,  photonic materials, optical fibers and active and passive optical components;

thermal phenomena in micro- and opto-electronic systems and thermal stresses;

adhesion problems and solutions;

thin film materials, physics and mechanics;

photorefractive materials and devices;

nanomaterials and nanotechnology;  

multiphysics modeling and optimization technologies;

experimental methods and techniques; 

testing methods and techniques, subjected to thermal loading, stress analyses of processed silicon wafers, and many others.

The book is intended  as a reference source and as a manual for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists. The book will be an essential tool for all those who are involved or interested in state-of-the-art in the analysis, design and manufacturing of micro- and opto-electronic systems.

Keywords

Helium-Atom-Streuung coating electronics integrated circuit interconnect laser metal microelectromechanical system (MEMS) microsystems optics optoelectronics packaging photonics production thin film

Editors and affiliations

  • E. Suhir
    • 1
    • 2
  • Y. C. Lee
    • 3
  • C. P. Wong
    • 4
  1. 1.University of CaliforniaSanta CruzUSA
  2. 2.University of MarylandCollege ParkUSA
  3. 3.University of ColoradoBoulderUSA
  4. 4.Georgia TechAtlantaUSA

Bibliographic information

  • DOI https://doi.org/10.1007/0-387-32989-7
  • Copyright Information Springer Science+Business Media, LLC 2007
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-0-387-27974-9
  • Online ISBN 978-0-387-32989-5
  • Buy this book on publisher's site