Advanced Microsystems for Automotive Applications 2005

  • Jürgen Valldorf
  • Wolfgang Gessner

Part of the Advanced Microsystems for Automotive Applications 2005 book series (VDI-BUCH)

Table of contents

  1. Front Matter
    Pages I-XVI
  2. Introduction

  3. Safety

    1. C. Rotaru, Th. Graf, J. Zhang
      Pages 61-69
    2. L.-P. Becker, A. Debski, D. Degenhardt, M. Hillenkamp, I. Hoffmann
      Pages 71-84
    3. J. Thiem, M. Mühlenberg
      Pages 97-114
    4. J. Sans Sangorrin, T. Sohnke, J. Hoetzel
      Pages 115-127
    5. H. Vogel, H. Schlemmer
      Pages 129-148
    6. A. Bodensohn, M. Haueis, R. Mäckel, M. Pulvermüller, T. Schreiber
      Pages 149-158
    7. A. Polychronopoulos, N. Möhler, S. Ghosh, A. Beutner
      Pages 169-183
    8. R. Adomat, G. Geduld, M. Schamberger, Jürgen Diebold, M. Klug
      Pages 185-196
    9. K. Dietmayer, N. Kämpchen, K. Fürstenberg, J. Kibbel, W. Justus, R. Schulz
      Pages 197-213
    10. K. Fürstenberg
      Pages 215-225
    11. T. Kvisterøy, N. Hedenstierna, G. Andersson, P. Pelin
      Pages 227-241
    12. A. Kormos, C. Hanson, C. Buettner
      Pages 243-256
    13. K. Nakagawa, M. Mitsumoto, K. Kai
      Pages 257-268
    14. J. Schier, R. Willig
      Pages 269-286
  4. Powertrain

    1. A. Buhrdorf, H. Dobrinski, O. Lüdtke, J. Bennett, L. Matsiev, M. Uhrich et al.
      Pages 289-298
    2. B. Cramer, B. Schumann, H. Schichlein, S. Thiemann-Handler, T. Ochs
      Pages 311-319
  5. Comfort and HMI

  6. Networked Vehicle

    1. D D. Ward, D. A. Topham, C. C. Constantinou, T. N. Arvanitis
      Pages 353-370
    2. T. Wipiejewski, F. Ho, B. Lui, W. Hung, F.-W. Tong, T. Choi et al.
      Pages 381-398
  7. Components and Generic Sensor Technologies

    1. S. Maddalena, A. Darmon, R. Diels
      Pages 401-412
    2. G. Dahlmann, G. Hölzer, S. Hering, U. Schwarz
      Pages 413-424
    3. W. Brockherde, C. Nitta, B.J. Hosticka, I. Krisch, A. Bußmann, R. Wertheimer
      Pages 425-433
    4. B. Vogelgesang, C. Bauer, R. Rettig
      Pages 435-446
    5. T. Ina, K. Takeda, T. Nakamura, O. Shimomura, T. Ban, T. Kawashima
      Pages 447-457
    6. Matthieu Reze, Jonathan Hammond
      Pages 459-471
  8. Intersafe

  9. Back Matter
    Pages 531-543

About this book


Since 1995 the annual international forum on Advanced Microsystems for Automotive Applications (AMAA) has been held in Berlin. The event offers a unique opportunity for microsystems component developers, system suppliers and car manufacturers to show and to discuss competing technological approaches of microsystems based solutions in vehicles.

The book accompanying the event has demonstrated to be an efficient instrument for the diffusion of new concepts and technology results. The present volume including the papers of the AMAA 2005 gives an overview on the state-of-the-art and outlines imminent and mid-term R&D perspectives. The 2005 publication reflects – as in the past – the current state of discussions within industry. More than the previous publications, the AMAA 2005 "goes back" to the technological requirements and indispensable developments for fulfilling the market needs. The large part of contributions dealing with sensors as well as "sensor technologies and data fusion" is exemplary for this tendency.

In this context a paradigm shift can be stated. In the past the development focused predominantly on the detection and processing of single parameters originating from single sensors. Today, the challenge increasingly consists in getting information of complex situations with a series of variables from different sensors and in evaluating this information. Smart integrated devices using the information deriving from the various sensor sources will be able to describe and assess a traffic situation or behaviour much faster and more reliable than a human being might be able to do.

Additional information is available on


AMAA Automobil Automobile Comfort HMI Networks Powertrain Radar Safety Vehicle

Editors and affiliations

  • Jürgen Valldorf
    • 1
  • Wolfgang Gessner
    • 2
  1. 1.VDI/VDE Innovation + Technik GmbHTeltow
  2. 2.VDI/VDE Innovation + Technik GmbHTeltow

Bibliographic information

  • DOI
  • Copyright Information Springer-Verlag Berlin Heidelberg 2005
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Engineering
  • Print ISBN 978-3-540-24410-3
  • Online ISBN 978-3-540-27463-6
  • Buy this book on publisher's site