Force Sensors for Microelectronic Packaging Applications

  • Jürg Schwizer
  • Michael Mayer
  • Oliver Brand

Part of the Microtechnology and MEMS book series (MEMS)

Table of contents

  1. Front Matter
    Pages I-VIII
  2. Pages 1-11
  3. Pages 13-48
  4. Pages 49-66
  5. Pages 67-92
  6. Pages 93-158
  7. Pages 159-160
  8. Back Matter
    Pages 161-178

About this book


This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.


Flip-chip Force sensor Piezoresistivity Process monitoring Semiconductor Sensor Technologie Wire bonding design development interconnect reliability technology

Authors and affiliations

  • Jürg Schwizer
    • 1
  • Michael Mayer
    • 2
  • Oliver Brand
    • 3
  1. 1.Infineon TechnologiesMunichGermany
  2. 2.Centre for Advanced Materials JoiningUniversity of WaterlooWaterlooCanada
  3. 3.School of Electrical and Computer EngineeringGeorgia Institute of TechnologyAtlantaUSA

Bibliographic information