Advertisement

Shape Memory Alloys for Seismic Resilience

  • Cheng Fang
  • Wei Wang

Table of contents

  1. Front Matter
    Pages i-xxi
  2. Cheng Fang, Wei Wang
    Pages 1-41
  3. Cheng Fang, Wei Wang
    Pages 43-96
  4. Cheng Fang, Wei Wang
    Pages 97-145
  5. Cheng Fang, Wei Wang
    Pages 147-177
  6. Cheng Fang, Wei Wang
    Pages 221-258
  7. Cheng Fang, Wei Wang
    Pages 259-284

About this book

Introduction

This book introduces readers to the fundamental properties and practical applications of shape memory alloys (SMAs) from the perspective of seismic engineering. It objectively discusses the superiority of this novel class of materials, which could potentially overcome the limitations of conventional seismic control technologies. The results, vividly presented in the form of tables and figures, are demonstrated with rigorous experimental verifications, supplemented by comprehensive numerical and analytical investigations.

The book allows readers to gain an in-depth understanding of the working mechanisms of various SMA-based structural devices and members, including beam-to-column connections, dampers, and braces, while also providing them with a broader vision of next-generation, performance-based seismic design for novel adaptive structural systems. Helping to bridge the gap between material science and structural engineering, it also sheds light on the potential of commercializing SMA products in the construction industry. The cutting-edge research highlighted here provides technical incentives for design professionals, contractors, and building officials to use high-performance and smart materials in structural design, helping them stay at the forefront of construction technology.

Keywords

Shape memory alloys Superelasticity Seismic Control Self-centering Dampers Braces Beam-to-column connections Base isolators Concrete Structures Applications of SMAs SMAs in civil engineering

Authors and affiliations

  • Cheng Fang
    • 1
  • Wei Wang
    • 2
  1. 1.Tongji UniversityShanghaiChina
  2. 2.Tongji UniversityShanghaiChina

Bibliographic information

  • DOI https://doi.org/10.1007/978-981-13-7040-3
  • Copyright Information Springer Nature Singapore Pte Ltd. 2020
  • Publisher Name Springer, Singapore
  • eBook Packages Engineering
  • Print ISBN 978-981-13-7039-7
  • Online ISBN 978-981-13-7040-3
  • Buy this book on publisher's site