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Modeling and Application of Flexible Electronics Packaging

  • YongAn Huang
  • Zhouping Yin
  • Xiaodong Wan

Table of contents

  1. Front Matter
    Pages i-xvii
  2. YongAn Huang, Zhouping Yin, Xiaodong Wan
    Pages 1-27
  3. YongAn Huang, Zhouping Yin, Xiaodong Wan
    Pages 29-48
  4. YongAn Huang, Zhouping Yin, Xiaodong Wan
    Pages 73-103
  5. YongAn Huang, Zhouping Yin, Xiaodong Wan
    Pages 105-138
  6. YongAn Huang, Zhouping Yin, Xiaodong Wan
    Pages 139-164
  7. YongAn Huang, Zhouping Yin, Xiaodong Wan
    Pages 165-200
  8. YongAn Huang, Zhouping Yin, Xiaodong Wan
    Pages 201-225
  9. YongAn Huang, Zhouping Yin, Xiaodong Wan
    Pages 227-279
  10. Back Matter
    Pages 281-287

About this book

Introduction

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.


Keywords

Flexible electronics Electronic packaging Transfer printing Laser-assisted transfer Picking-up and placing-on transfer printing equipment

Authors and affiliations

  • YongAn Huang
    • 1
  • Zhouping Yin
    • 2
  • Xiaodong Wan
    • 3
  1. 1.State Key Laboratory of Digital Manufacturing Equipment and TechnologyHuazhong University of Science and Technology (HUST)WuhanChina
  2. 2.State Key Laboratory of Digital Manufacturing Equipment and TechnologyHuazhong University of Science and Technology (HUST)WuhanChina
  3. 3.State Key Laboratory of Digital Manufacturing Equipment and TechnologyHuazhong University of Science and Technology (HUST)WuhanChina

Bibliographic information

  • DOI https://doi.org/10.1007/978-981-13-3627-0
  • Copyright Information Science Press and Springer Nature Singapore Pte Ltd. 2019
  • Publisher Name Springer, Singapore
  • eBook Packages Engineering
  • Print ISBN 978-981-13-3626-3
  • Online ISBN 978-981-13-3627-0
  • Buy this book on publisher's site