Advances in Rapid Thermal and Integrated Processing

  • Fred Roozeboom

Part of the NATO ASI Series book series (NSSE, volume 318)

Table of contents

  1. Front Matter
    Pages i-xii
  2. Chuck Schietinger
    Pages 103-123
  3. Chuck Schietinger
    Pages 125-141
  4. Mehrdad M. Moslehi, Yong Jin Lee, Charles Schaper, Thomas Omstead, Lino Velo, Ahmad Kermani et al.
    Pages 163-192
  5. Ian W. Boyd
    Pages 235-264
  6. K. F. Jensen, T. P. Merchant, J. V. Cole, J. P. Hebb, K. L. Knutson, T. G. Mihopoulos
    Pages 265-304
  7. K. F. Jensen, H. Simka, T. G. Mihopoulos, P. Futerko, M. Hierlemann
    Pages 305-331
  8. E. Conrad, P. Müller, A. Kermani
    Pages 415-429
  9. L. Deutschmann, F. Glowacki
    Pages 431-441
  10. Ting Feng, Aris Christou, D. Girginoudi, Z. Hatzopoulos
    Pages 493-520
  11. Back Matter
    Pages 553-565

About this book


Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.


Metall Semiconductor electrical engineering materials science semiconductors thin film

Editors and affiliations

  • Fred Roozeboom
    • 1
  1. 1.Philips Research LaboratoriesEindhovenThe Netherlands

Bibliographic information

  • DOI
  • Copyright Information Springer Science+Business Media B.V. 1996
  • Publisher Name Springer, Dordrecht
  • eBook Packages Springer Book Archive
  • Print ISBN 978-90-481-4696-3
  • Online ISBN 978-94-015-8711-2
  • Series Print ISSN 0168-132X
  • Buy this book on publisher's site