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Microelectronic Interconnections and Assembly

  • George Harman
  • Pavel Mach

Part of the NATO ASI Series book series (ASHT, volume 54)

Table of contents

  1. Front Matter
    Pages i-xiv
  2. Packaging and Interconnection Trends - Present and Future

    1. Nihal Sinnadurai
      Pages 21-32
    2. Orla Slattery, Ciaran Cahill, John Barrett, Martin O’Flaherty, Kenneth Rodgers
      Pages 33-43
  3. Solder and Flip Chip Interconnections and Assembly

    1. W. Kinzy Jones, Y. Q. Liu, Marc A. Zampino, Gerardo L. Gonzalez
      Pages 53-58
    2. Peter Bodo, Hans Hentzell, Jan Strandberg, Joacim Haglund, Sima Valizadeh
      Pages 79-79
    3. P. Annala, J. Kaitila, J. Salonen, I. Suni
      Pages 81-86
    4. Peter J. Gielisse, Meirong Tu, Dongming Y. White, Yang Xu Famu-Fsu
      Pages 97-108
  4. Single Chip Interconnection and Qualification: Wire Bonding and TAB

    1. Zsolt Illyefalvi-Vitéz, János Pinkola, László Gál, Endre Tóth
      Pages 109-117
    2. J. Roggen, E. Beyne, C. Truzzi, E. Ringoot, P. Pieters
      Pages 141-144
  5. Multichip Module Interconnections and Assembly I

    1. Gérard Dehaine, Patrick Courant, Karel Kurzweil
      Pages 145-155
    2. T. Pisarkiewicz, T. Habdank-Wojewodzki, M. Ciez
      Pages 179-184
  6. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters

  7. Multichip Module Interconnections and Assembly II

    1. Pierre Plaza, Jose Luis Conesa
      Pages 187-191
    2. A. Kikinesshy, M. Marjan, V. Vlasov, I. Mojzes, G. Ripka
      Pages 213-216
  8. Thick Film Interconnections and Metallurgical Interactions I

  9. Thick Film Interconnections and Metallurgical Interactions II

    1. Darko Belavič, Srečko Maček, Stojan Šoba, Marko Pavlin, Marko Hrovat, Dubravka Ročak
      Pages 237-247
    2. František Kolesár, Miloš Somora
      Pages 257-261
  10. Back Matter
    Pages 295-299

About this book

Introduction

MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.

Keywords

Metall fatigue interconnect metal metallurgy polymer production thin film

Editors and affiliations

  • George Harman
    • 1
  • Pavel Mach
    • 2
  1. 1.Semiconductor Electronics DivisionNational Institute of Standards and TechnologyGaithersburgUSA
  2. 2.Department of ElectrotechnologyCzech Technical University in PraguePragueCzech Republic

Bibliographic information

  • DOI https://doi.org/10.1007/978-94-011-5135-1
  • Copyright Information Kluwer Academic Publishers 1998
  • Publisher Name Springer, Dordrecht
  • eBook Packages Springer Book Archive
  • Print ISBN 978-94-010-6159-9
  • Online ISBN 978-94-011-5135-1
  • Series Print ISSN 1388-6576
  • Buy this book on publisher's site