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Thermal Management of Electronic Systems

Proceedings of EUROTHERM Seminar 29, 14–16 June 1993, Delft, The Netherlands

  • Conference proceedings
  • © 1994

Overview

Editors:
  1. C. J. Hoogendoorn

    1. J. M. Burgers Centre for Fluid Mechanics, Delft University of Technology, Delft, The Netherlands

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  2. R. A. W. M. Henkes

    1. J. M. Burgers Centre for Fluid Mechanics, Delft University of Technology, Delft, The Netherlands

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  3. C. J. M. Lasance

    1. Philips B.V., Eindhoven, The Netherlands

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Table of contents (29 papers)

  1. Numerical and Experimental Analysis of Electronic Parts

    1. Computational modelling of wafer cooldown in a staging module

      • K. Nederveen
      Pages 179-187

  4. Thermal Characterization of Electronic Parts

    1. Front Matter

      Pages 255-255
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    2. Thermal Design of a 419 Pins Ceramic Pin Grid Array Package

      • Thierry Fromont
      Pages 257-266

    3. Design of an optimal heat-sink geometry for forced convection air cooling of Multi-Chip Modules

      • B. Boesmans, F. Christiaens, J. Berghmans, E. Beyne
      Pages 267-276

    4. Thermal characterization and design for high performance multichip module type laminate

      • E. Lauwers, A. Ackaert, K. Allaert, W. Temmerman, W. Nelemans, T. Goossens
      Pages 277-286

    5. The thermal characteristics of a board-mounted 160 lead plastic quad flat pack.

      • M. Davies, J. Lohan, J. Punch, T. Moore
      Pages 287-296

    6. Investigation of Die Attach Integrity Using Transient Thermal Analysis Techniques

      • Daguang Liu, John Barrett, Séan Cian Ó Mathúna
      Pages 297-306

  5. Thermal Stress and Die Attach Defects

    1. Front Matter

      Pages 307-307
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    2. Thermal Stress In Convectively-Cooled Plastic-Encapsulated Chip Packages

      • Sorin Witzman, Devin E. Mix, Avram Bar-Cohen
      Pages 309-323

    3. Impact of Die Attach Defects on Internal Temperature of Power Hybrids

      • F. Michard, J. M. Dupont, H. Ribot, M. Salagoity
      Pages 325-334

  6. Back Matter

    Pages 335-335
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Keywords

About this book

The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera­ tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea­ sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.

Editors and Affiliations

  • J. M. Burgers Centre for Fluid Mechanics, Delft University of Technology, Delft, The Netherlands

    C. J. Hoogendoorn, R. A. W. M. Henkes

  • Philips B.V., Eindhoven, The Netherlands

    C. J. M. Lasance

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