Thermal Management of Electronic Systems

Proceedings of EUROTHERM Seminar 29, 14–16 June 1993, Delft, The Netherlands

  • C. J. Hoogendoorn
  • R. A. W. M. Henkes
  • C. J. M. Lasance

Table of contents

  1. Front Matter
    Pages i-xi
  2. Invited Lectures

  3. Numerical and Experimental Analysis of Systems

    1. Front Matter
      Pages 43-43
    2. S. Drake, M. White, A. Felthouse, C. Ganderton, S. Glanfield
      Pages 45-54
    3. J. D. Parry, D. G. Tatchell
      Pages 55-64
    4. H. Bruneel, B. Beernaert, G. Mortier, J. Declercq, B. Boesmans, W. Temmerman et al.
      Pages 65-74
  4. Numerical and Experimental Analysis of Channels

    1. Front Matter
      Pages 95-95
    2. C. Di Perna, A. Evangelisti, M. Paroncini, R. Ricci
      Pages 97-106
    3. O. Manca, S. Nardini, V. Naso
      Pages 117-126
  5. Numerical and Experimental Analysis of Electronic Parts

  6. Measurement Techniques

  7. Liquid Cooling of Electronic Devices

  8. Thermal Characterization of Electronic Parts

    1. Front Matter
      Pages 255-255
    2. B. Boesmans, F. Christiaens, J. Berghmans, E. Beyne
      Pages 267-276
    3. E. Lauwers, A. Ackaert, K. Allaert, W. Temmerman, W. Nelemans, T. Goossens
      Pages 277-286
    4. M. Davies, J. Lohan, J. Punch, T. Moore
      Pages 287-296
    5. Daguang Liu, John Barrett, Séan Cian Ó Mathúna
      Pages 297-306
  9. Thermal Stress and Die Attach Defects

    1. Front Matter
      Pages 307-307
    2. Sorin Witzman, Devin E. Mix, Avram Bar-Cohen
      Pages 309-323
    3. F. Michard, J. M. Dupont, H. Ribot, M. Salagoity
      Pages 325-334
  10. Back Matter
    Pages 335-335

About these proceedings


The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera­ tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea­ sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.


design development measurement techniques packaging stress

Editors and affiliations

  • C. J. Hoogendoorn
    • 1
  • R. A. W. M. Henkes
    • 1
  • C. J. M. Lasance
    • 2
  1. 1.J. M. Burgers Centre for Fluid MechanicsDelft University of TechnologyDelftThe Netherlands
  2. 2.Philips B.V.EindhovenThe Netherlands

Bibliographic information