MCM C/Mixed Technologies and Thick Film Sensors

  • W. Kinzy Jones
  • Karel Kurzweil
  • Gábor Harsányi
  • Sylvia Mergui

Part of the NATO ASI Series book series (ASHT, volume 2)

Table of contents

  1. Front Matter
    Pages i-x
  2. Christian M. Val
    Pages 1-18
  3. P. Johnsson, C. Vaktnäs, N. Billström
    Pages 23-28
  4. D. Lambert, K. Kurzweil
    Pages 35-43
  5. Z. Illyefalvi-Vitéz
    Pages 69-76
  6. E. Gambarte, M. Töpfer, A. Paredes, M. Reill, M. Weickhmann
    Pages 89-100
  7. W. K. Jones, M. A. Zampino
    Pages 101-111
  8. A. Coello-Vera, P. Oudart, P. D’Andrea, G. Cysarek
    Pages 121-130
  9. J. A. De Givry
    Pages 131-138
  10. K. Lösch, H. M. Rappold
    Pages 139-146
  11. Jose Luis Conesa, Pierre Plaza
    Pages 147-152
  12. S. Fazelpour, B. Bölike, R. Brodowski, R. Dümcke, H. Reichl
    Pages 153-167
  13. Harry K. Charles Jr.
    Pages 177-193
  14. N. Chandler, N. E. Sellars, R. K. Barton, S. J. Foster, P. D. Sleep, G. N. Blackie et al.
    Pages 195-207
  15. Rosario A. Gerhardt, Julie R. Kokan, Paul A. Kohl
    Pages 209-219
  16. Thomas J. Sanders, C. Roy Miller, Kurt E. Gsteiger, Glenn T. Hess, Duraiswami Nedunchellyan
    Pages 221-226
  17. Sylvia Mergui
    Pages 239-257
  18. J. Hormadaly, S. J. Horowitz, J. R. Larry, P. O’Callaghan
    Pages 259-265
  19. I. Baťko, K. Flachbart, M. Somora, D. Vanický
    Pages 299-305
  20. I. Křivka, J. Kubát, R. Kužel, J. Prokeš
    Pages 307-314
  21. Back Matter
    Pages 315-318

About this book


Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity.
MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.
MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.


Laser Sensor communication complexity dielectrics electronics integrated circuit optoelectronics polymer static-induction transistor thin film

Editors and affiliations

  • W. Kinzy Jones
    • 1
  • Karel Kurzweil
    • 2
  • Gábor Harsányi
    • 3
  • Sylvia Mergui
    • 4
  1. 1.Department of Mechanical EngineeringFlorida International UniversityMiamiUSA
  2. 2.BULL, SALes Clayes-sous-BoisFrance
  3. 3.Department of Electronics TechnologyTechnical University of BudapestBudapestHungary
  4. 4.Department of Electrical EngineeringFlorida International UniversityMiamiUSA

Bibliographic information

  • DOI
  • Copyright Information Kluwer Academic Publishers 1995
  • Publisher Name Springer, Dordrecht
  • eBook Packages Springer Book Archive
  • Print ISBN 978-94-010-4039-6
  • Online ISBN 978-94-011-0079-3
  • Series Print ISSN 1388-6576
  • Buy this book on publisher's site