Predictive Simulation of Semiconductor Processing

Status and Challenges

  • Jarek Dabrowski
  • Eicke R. Weber

Part of the Springer Series in MATERIALS SCIENCE book series (SSMATERIALS, volume 72)

Table of contents

  1. Front Matter
    Pages I-XVII
  2. J. Dąbrowski, E. R. Weber, H.-J. Müssig, W. Schröter
    Pages 1-38
  3. A. Asenov, A. R. Brown, S. Kaya
    Pages 111-156
  4. H. J. Osten, J. Dąbrowski, H.-J. Müssig, A. Fissel, V. Zavodinsky
    Pages 259-294
  5. A. A. Bagatur’yants, A. K. Minushev, K. P. Novoselov, A. A. Safonov, S. Ya. Umanskii, A. S. Vladimirov et al.
    Pages 295-355
  6. R. Sabelka, C. Harlander, S. Selberherr
    Pages 357-385
  7. V. Petrescu, W. Schoenmaker
    Pages 387-456
  8. Back Matter
    Pages 469-493

About this book


Predictive simulation of semiconductor processing enables researchers and developers to extend the scaling range of semiconductor devices beyond the parameter range of empirical research. It requires a thorough understanding of the basic mechanisms employed in device fabrication, such as diffusion, ion implantation, epitaxy, defect formation and annealing, and contamination. This book presents an in-depth discussion of our current understanding of key processes and identifies areas that require further work in order to achieve the goal of a comprehensive, predictive process simulation tool.


Deposition processes Device reliability and process yield Diffusion Dopant and impurity diffusion Microelectronic technology Semiconductor Signal propagation materials science metal modeling semiconductor devices simulation transistor

Editors and affiliations

  • Jarek Dabrowski
    • 1
  • Eicke R. Weber
    • 2
  1. 1.IHPFrankfurt (Oder)Germany
  2. 2.Department of Materials ScienceUniversity of CaliforniaBerkeleyUSA

Bibliographic information

  • DOI
  • Copyright Information Springer-Verlag Berlin Heidelberg 2004
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Springer Book Archive
  • Print ISBN 978-3-642-05804-2
  • Online ISBN 978-3-662-09432-7
  • Series Print ISSN 0933-033X
  • Series Online ISSN 2196-2812
  • Buy this book on publisher's site