Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits

  • Wenjian Yu
  • Xiren Wang

Table of contents

  1. Front Matter
    Pages i-xv
  2. Wenjian Yu, Xiren Wang
    Pages 1-6
  3. Wenjian Yu, Xiren Wang
    Pages 7-18
  4. Wenjian Yu, Xiren Wang
    Pages 71-89
  5. Wenjian Yu, Xiren Wang
    Pages 107-119
  6. Wenjian Yu, Xiren Wang
    Pages 121-152
  7. Wenjian Yu, Xiren Wang
    Pages 209-231
  8. Back Matter
    Pages 233-246

About this book


Resistance and capacitance (RC) extraction is an essential step in modeling the interconnection wires and substrate coupling effect in nanometer-technology integrated circuits (IC). The field-solver techniques for RC extraction guarantee the accuracy of modeling, and are becoming increasingly important in meeting the demand for accurate modeling and simulation of VLSI designs. Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits presents a systematic introduction to, and treatment of, the key field-solver methods for RC extraction of VLSI interconnects and substrate coupling in mixed-signal ICs. Various field-solver techniques are explained in detail, with real-world examples to illustrate the advantages and disadvantages of each algorithm.

This book will benefit graduate students and researchers in the field of electrical and computer engineering, as well as engineers working in the IC design and design automation industries.

Dr. Wenjian Yu is an Associate Professor at the Department of Computer Science and Technology at Tsinghua University in China; Dr. Xiren Wang is a R&D Engineer at Cadence Design Systems in the USA.


Boundary Element Method Computer-aided Design of Integrated Circuits Field Solver Algorithms Parasitic Extraction

Authors and affiliations

  • Wenjian Yu
    • 1
  • Xiren Wang
    • 2
  1. 1.Dept. of Computer Science and TechnologyTsinghua UniversityBeijingChina
  2. 2.Cadence Design SystemsSan JoseUSA

Bibliographic information

  • DOI
  • Copyright Information Tsinghua University Press, Beijing and Springer-Verlag Berlin Heidelberg 2014
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Engineering
  • Print ISBN 978-3-642-54297-8
  • Online ISBN 978-3-642-54298-5
  • About this book