3-Dimensional VLSI

A 2.5-Dimensional Integration Scheme

  • Yangdong Deng
  • Wojciech P. Maly

Table of contents

  1. Front Matter
    Pages i-xii
  2. Yangdong Steve Deng, Wojciech P. Maly
    Pages 1-20
  3. Yangdong Steve Deng, Wojciech P. Maly
    Pages 21-41
  4. Yangdong Steve Deng, Wojciech P. Maly
    Pages 42-73
  5. Yangdong Steve Deng, Wojciech P. Maly
    Pages 74-82
  6. Yangdong Steve Deng, Wojciech P. Maly
    Pages 83-116
  7. Yangdong Steve Deng, Wojciech P. Maly
    Pages 117-143
  8. Yangdong Steve Deng, Wojciech P. Maly
    Pages 144-163
  9. Yangdong Steve Deng, Wojciech P. Maly
    Pages 164-187
  10. Back Matter
    Pages 188-194

About this book

Introduction

"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.

Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.

Keywords

2.5-D integration 3-D integration Integrated circuits TUP VLSI VLSI Design VLSI IC Very-large-scale integration design automation electronic design automation integrated circuit semiconductor

Authors and affiliations

  • Yangdong Deng
    • 1
  • Wojciech P. Maly
    • 2
  1. 1.Institute of MicroelectronicsTsinghua UniversityBeijingP. R. China
  2. 2.Electrical and Computer EngineeringCarnegie Mellon UniversityPittsburghUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-642-04157-0
  • Copyright Information Springer-Verlag Berlin Heidelberg 2010
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Engineering
  • Print ISBN 978-3-642-04156-3
  • Online ISBN 978-3-642-04157-0
  • About this book