Lock-in Thermography

Basics and Use for Evaluating Electronic Devices and Materials

  • Otwin Breitenstein
  • Wilhelm Warta
  • Martin Langenkamp

Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 10)

Table of contents

  1. Front Matter
    Pages i-x
  2. Otwin Breitenstein, Wilhelm Warta, Martin Langenkamp
    Pages 1-6
  3. Otwin Breitenstein, Wilhelm Warta, Martin Langenkamp
    Pages 7-59
  4. Otwin Breitenstein, Wilhelm Warta, Martin Langenkamp
    Pages 61-99
  5. Otwin Breitenstein, Wilhelm Warta, Martin Langenkamp
    Pages 101-147
  6. Otwin Breitenstein, Wilhelm Warta, Martin Langenkamp
    Pages 149-175
  7. Otwin Breitenstein, Wilhelm Warta, Martin Langenkamp
    Pages 177-228
  8. Otwin Breitenstein, Wilhelm Warta, Martin Langenkamp
    Pages 229-233
  9. Back Matter
    Pages 235-255

About this book

Introduction

This book deals with lock-in thermography (LIT) as a special active dynamic variant of the well-known IR thermography. It enables a much improved signal-to-noise ratio (up to 1000x) and a far better lateral resolution compared to steady-state thermography. The book concentrates on applications to electronic devices and materials, but the basic chapters are useful as well for non-destructive evaluation. Various experimental approaches to LIT are reviewed with special emphasis to different available commercial LIT systems. New LIT applications are reviewed, like Illuminated LIT applied to solar cells , and non-thermal LIT lifetime mapping. Typical LIT investigation case studies are introduced.

Keywords

Failure analysis Lifetime mapping Shunt imaging Solar cell characterization Trap density mapping diagnosis thermography

Authors and affiliations

  • Otwin Breitenstein
    • 1
  • Wilhelm Warta
    • 2
  • Martin Langenkamp
    • 3
  1. 1.MPI für MikrostrukturphysikHalleGermany
  2. 2.Solare Energiesysteme (ISE)Fraunhofer-Institut fürFreiburgGermany
  3. 3.RendsburgGermany

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-642-02417-7
  • Copyright Information Springer-Verlag Berlin Heidelberg 2010
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Engineering
  • Print ISBN 978-3-642-02416-0
  • Online ISBN 978-3-642-02417-7
  • Series Print ISSN 1437-0387
  • About this book