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Vacuum Electronics

Components and Devices

  • Joseph A. Eichmeier
  • Manfred K. Thumm

Table of contents

  1. Front Matter
    Pages i-xvii
  2. G. Faillon, G. Kornfeld, E. Bosch, M. K. Thumm
    Pages 1-84
  3. K. Blankenbach, G. Gassler, H. W. P. Koops
    Pages 85-126
  4. H. Bluhm, B. Han, A. G. Chmielewski, D. von Dobeneck, U. Gohs, J. Gstöttner et al.
    Pages 155-230
  5. F. Rüdenauer, H. W. P. Koops, G. Hobler, L. Palmetshofer, H. Bluhm
    Pages 231-263
  6. H. Bassner, R. Killinger, J. Mitterauer, F. Rüdenauer, N. Koch, G. Kornfeld
    Pages 265-301
  7. A. Ulrich, M. Born, H. W. P. Koops, H. Bluhm, T. Jüstel
    Pages 303-354
  8. M. Seidel, K. Zapfe
    Pages 355-405
  9. R. Renz
    Pages 407-428
  10. G. Gaertner, H. W. P. Koops
    Pages 429-481
  11. W. Knapp
    Pages 483-520
  12. Back Matter
    Pages 521-535

About this book

Introduction

Nineteen experts from the electronics industry, research institutes and universities have joined forces to prepare this book. Vacuum Electronics covers the electrophysical fundamentals, the present state of the art and applications, as well as the future prospects of microwave tubes and systems, optoelectronics vacuum devices, electron and ion beam devices, light and X-ray emitters,particle accelerators and vacuum interrupters. These topics are supplemented by useful information about the materials and technologies of vacuum electronics and vacuum technology.

Keywords

Electron and ion beam devices Microwave tubes and systems Optoelectronic vacuum devices Technologie Vacuum technology Vacuumelectronic components X-ray electronics laser material optoelectronics technology

Editors and affiliations

  • Joseph A. Eichmeier
    • 1
  • Manfred K. Thumm
    • 2
  1. 1.Lehrstuhl für Technische ElektronikTU MünchenMünchenGermany
  2. 2.Institut für Hochleistungsimpuls- und MikrowellentechnikForschungszentrum KarlsruheKarlsruheGermany

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-540-71929-8
  • Copyright Information Springer-Verlag Berlin Heidelberg 2008
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Engineering
  • Print ISBN 978-3-540-71928-1
  • Online ISBN 978-3-540-71929-8
  • Buy this book on publisher's site