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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Materials, Processes, Equipment, and Reliability

  • Kim S.¬†Siow

Table of contents

  1. Front Matter
    Pages i-xx
  2. H. Zhang, K. Suganuma
    Pages 35-65
  3. K. S. Siow, V. R. Manikam, S. T. Chua
    Pages 67-105
  4. P. P. Paret, D. J. DeVoto, S. V. J. Narumanchi
    Pages 107-124
  5. S. Mannan, A. Paknejad, A. Mansourian, K. Khtatba
    Pages 151-163
  6. J. R. Holaday, C. A. Handwerker
    Pages 197-249
  7. Back Matter
    Pages 275-279

About this book

Introduction

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.

  • Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;
  • Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;
  • Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Keywords

Sintered silver Nano-silver sintering Low temperature joining technology Lead-free die attach Power module Hybrid electric vehicle Solder solidification Solder alloys High temperature alloys Process control

Editors and affiliations

  • Kim S.¬†Siow
    • 1
  1. 1.Institute of Microengineering and NanoelectronicsUniversiti Kebangsaan MalaysiaBangi SelangorMalaysia

Bibliographic information