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Ultra Low Power ECG Processing System for IoT Devices

  • Temesghen Tekeste Habte
  • Hani Saleh
  • Baker Mohammad
  • Mohammed Ismail

Part of the Analog Circuits and Signal Processing book series (ACSP)

Table of contents

  1. Front Matter
    Pages i-xv
  2. Temesghen Tekeste Habte, Hani Saleh, Baker Mohammad, Mohammed Ismail
    Pages 1-6
  3. Temesghen Tekeste Habte, Hani Saleh, Baker Mohammad, Mohammed Ismail
    Pages 7-12
  4. Temesghen Tekeste Habte, Hani Saleh, Baker Mohammad, Mohammed Ismail
    Pages 13-26
  5. Temesghen Tekeste Habte, Hani Saleh, Baker Mohammad, Mohammed Ismail
    Pages 27-38
  6. Temesghen Tekeste Habte, Hani Saleh, Baker Mohammad, Mohammed Ismail
    Pages 39-57
  7. Temesghen Tekeste Habte, Hani Saleh, Baker Mohammad, Mohammed Ismail
    Pages 59-83
  8. Back Matter
    Pages 85-94

About this book

Introduction

This book describes an ECG processing architecture that guides biomedical SoC developers, from theory to implementation and testing. The authors provide complete coverage of the digital circuit implementation of an ultra-low power biomedical SoC,  comprised of a detailed description of an ECG processor implemented and fabricated on chip.  Coverage also includes the challenges and tradeoffs of designing ECG processors.   

  • Describes digital circuit architecture for implementing ECG processing algorithms on chip;
  • Includes coverage of signal processing techniques for ECG processing;
  • Features ultra-low power circuit design techniques;
  • Enables design of ECG processing architectures and their respective on-chip implementation.

Keywords

Bio-Medical CMOS ICs biomedical processors for IoT ECG processing algorithms and architectures ECG feature extraction architecture Ventricular arrhythmia prediction architecture

Authors and affiliations

  • Temesghen Tekeste Habte
    • 1
  • Hani Saleh
    • 2
  • Baker Mohammad
    • 3
  • Mohammed Ismail
    • 4
  1. 1.Khalifa UniversityAbu DhabiUnited Arab Emirates
  2. 2.Khalifa UniversityAbu DhabiUnited Arab Emirates
  3. 3.Khalifa UniversityAbu DhabiUnited Arab Emirates
  4. 4.Wayne State UniversityDetroitUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-97016-5
  • Copyright Information Springer International Publishing AG, part of Springer Nature 2019
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-97015-8
  • Online ISBN 978-3-319-97016-5
  • Series Print ISSN 1872-082X
  • Series Online ISSN 2197-1854
  • Buy this book on publisher's site