Low-Power Design and Power-Aware Verification

  • ProgynaĀ Khondkar

Table of contents

  1. Front Matter
    Pages i-xv
  2. Progyna Khondkar
    Pages 1-2
  3. Progyna Khondkar
    Pages 3-9
  4. Progyna Khondkar
    Pages 11-68
  5. Progyna Khondkar
    Pages 69-80
  6. Progyna Khondkar
    Pages 81-108
  7. Progyna Khondkar
    Pages 109-130
  8. Progyna Khondkar
    Pages 131-153
  9. Back Matter
    Pages 155-155

About this book


Until now, there has been a lack of a complete knowledge base to fully comprehend Low power (LP) design and power aware (PA) verification techniques and methodologies and deploy them all together in a real design verification and implementation project. This book is a first approach to establishing a comprehensive PA knowledge base.

LP design, PA verification, and Unified Power Format (UPF) or IEEE-1801 power format standards are no longer special features. These technologies and methodologies are now part of industry-standard design, verification, and implementation flows (DVIF). Almost every chip design today incorporates some kind of low power technique either through power management on chip, by dividing the design into different voltage areas and controlling the voltages, through PA dynamic and PA static verification, or their combination.

The entire LP design and PA verification process involves thousands of techniques, tools, and methodologies, employed from the r

egister transfer level (RTL) of design abstraction down to the synthesis or place-and-route levels of physical design. These techniques, tools, and methodologies are evolving everyday through the progression of design-verification complexity and more intelligent ways of handling that complexity by engineers, researchers, and corporate engineering policy makers. 


Silicon Engineering Low Power Design Power Aware Verification Unified Power Format (UPF) Static Verification Dynamic Verification Chip Design

Authors and affiliations

  • ProgynaĀ Khondkar
    • 1
  1. 1.Design Verification SpecialistMentor Graphics - A Siemens BusinessFremontUSA

Bibliographic information

  • DOI
  • Copyright Information Springer International Publishing AG 2018
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-66618-1
  • Online ISBN 978-3-319-66619-8
  • Buy this book on publisher's site