Recent Developments in Mechatronics and Intelligent Robotics

Proceedings of the International Conference on Mechatronics and Intelligent Robotics (ICMIR2017) - Volume 1

  • Feng Qiao
  • Srikanta Patnaik
  • John Wang
Conference proceedings ICMIR 2017

Part of the Advances in Intelligent Systems and Computing book series (AISC, volume 690)

Table of contents

  1. Front Matter
    Pages i-xviii
  2. Intelligent Systems

    1. Front Matter
      Pages 1-1
    2. Yiheng Hu, Zhihua Hu, Jin Chen
      Pages 15-20
    3. Zhu Jiang, Wen ChuanHua, Xu Xin Wei, Du Wei
      Pages 21-25
    4. Chenghao Zhang, Weifeng Zhong, Chunyu Zhang, Xi Qin
      Pages 36-42
    5. Zhang Li-hua, Dou Zhi-qian, Sun Guo-long
      Pages 49-54
    6. Wang Wei, Xiong Ying, Wang Xin
      Pages 55-61
    7. Ying Liu, Xiang-jun Wang, Xin-yi Jiang
      Pages 68-74
    8. Xue-jiao Liu, Xiang-guang Chen, Zhi-ming Li, Ni Du, Ling-tong Tang
      Pages 75-82
    9. Ni Du, Ling-tong Tang, Xue-jiao Liu, Xiang-guang Chen
      Pages 83-90
    10. Ling-tong Tang, Jian-wen Yang, Xiang-guang Chen, Min-pu Yao, Su-yi Huang, De-shou Ma et al.
      Pages 91-97
    11. Xu Ming, Yan Binzhou, Guo Shuxia, Gao Ying
      Pages 104-111
    12. Likun Zheng, Yongxin Qu, Hui Zhang, Huiying Shi, Xinglan Wang
      Pages 112-116
    13. Yanfei Liu, Jieling Wang, Jingjing Yang, Qi Li
      Pages 117-122

Other volumes

  1. Recent Developments in Mechatronics and Intelligent Robotics
    Proceedings of the International Conference on Mechatronics and Intelligent Robotics (ICMIR2017) - Volume 1
  2. Proceedings of the International Conference on Mechatronics and Intelligent Robotics (ICMIR2017) – Volume 2

About these proceedings

Introduction

This book gathers the Proceedings of the International Conference on Mechatronics and Intelligent Robotics (ICMIR2017), held in Kunming, China, on May 20–21, 2017. The book covers a total of 172 papers, which have been divided into seven different sections: Intelligent Systems, Intelligent Sensors & Actuators, Robotics, Mechatronics, Modeling & Simulation, Automation & Control, and Robot Vision.
 
ICMIR2017 provided a vital forum for discussing the latest and most innovative ideas from both the industrial and academic worlds, and for sharing best practices in the fields of mechanical engineering, mechatronics, automatic control, electrical engineering, finite element analysis and computational engineering. 

The main focus of the conference was on promoting interaction between academia and industry, allowing the free exchange of ideas and challenges faced by these two key stakeholders and encouraging future collaboration between the members of these groups. The proceedings cover new findings in the following areas of research and will offer readers valuable insights:
 
Mechatronics
 
Intelligent mechatronics, robotics and biomimetics; Novel and unconventional mechatronic systems; Modeling and control of mechatronics systems; Elements, structures and mechanisms of micro and nano systems; Sensors, wireless sensor networks and multi-sensor data fusion; Biomedical and rehabilitation engineering, prosthetics and artificial organs; Artificial Intelligence (AI), neural networks and fuzzy logic in mechatronics and robotics; Industrial automation, process control and networked control systems; Telerobotics, Human–Computer Interaction; and Human–Robot Interaction.
 
Robotics
 
Artificial Intelligence; Bio-inspired robotics; Control algorithms and control systems; Design theories and principles; Evolutional r
obotics; Field robotics; Force sensors, accelerometers, and other measuring devices; Healthcare robotics; Human–Robot Interaction; Kinematics and dynamics analysis; Manufacturing robotics; Mathematical and computational methodologies in robotics; Medical robotics; Parallel robots and manipulators; Robotic cognition and emotion; Robotic perception and decisions; Sensor integration, fusion, and perception; and Social robotics.

Keywords

Intelligent Systems Robotics Mechatronics ICMIR ICMIR 2017

Editors and affiliations

  • Feng Qiao
    • 1
  • Srikanta Patnaik
    • 2
  • John Wang
    • 3
  1. 1.Shenyang Jianzhu University ShenyangChina
  2. 2.SOA University BhubaneswarIndia
  3. 3.Montclair State University MontclairUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-65978-7
  • Copyright Information Springer International Publishing AG 2018
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-65977-0
  • Online ISBN 978-3-319-65978-7
  • Series Print ISSN 2194-5357
  • Series Online ISSN 2194-5365
  • About this book