More-than-Moore 2.5D and 3D SiP Integration

  • Riko Radojcic

Table of contents

  1. Front Matter
    Pages i-xv
  2. Riko Radojcic
    Pages 1-4
  3. Riko Radojcic
    Pages 117-157
  4. Riko Radojcic
    Pages 159-180
  5. Back Matter
    Pages 181-182

About this book


This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.  


3D Integrated Circuits 2.5/3D Integration Low-dimensional nanoensembles Fabless vs Foundry Advanced packaging technologies for microelectronics

Authors and affiliations

  • Riko Radojcic
    • 1
  1. 1.San DiegoUSA

Bibliographic information

  • DOI
  • Copyright Information Springer International Publishing AG 2017
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-52547-1
  • Online ISBN 978-3-319-52548-8
  • Buy this book on publisher's site