RF and Microwave Microelectronics Packaging II

  • Ken Kuang
  • Rick Sturdivant

About this book

Introduction

  • Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis
  • Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies
  • Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers


This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Keywords

Microwave and millimeter-wave frequencies EMI shielding Chip size packaging for RF MEMS Ceramic and Laminate packaging High power electronics Thermal management system design Thin film substrate Advanced power amplifiers Millimeter wave circuit technology Quality control and failure analysis Waver level packaging System integration packaging technologies High thermal conductivity

Editors and affiliations

  • Ken Kuang
    • 1
  • Rick Sturdivant
    • 2
  1. 1.Torrey Hills Technologies, LLCSan DiegoUSA
  2. 2.Azusa Pacific UniversityAzusaUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-51697-4
  • Copyright Information Springer International Publishing AG 2017
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-51696-7
  • Online ISBN 978-3-319-51697-4
  • About this book