Materials for Advanced Packaging

  • Daniel Lu
  • C.P. Wong

Table of contents

  1. Front Matter
    Pages i-xvi
  2. Dingyou Zhang, James J.-Q. Lu
    Pages 1-26
  3. Chin C. Lee, Chu-Hsuan Sha, Yuan-Yun Wu, Shou-Jen Hsu
    Pages 27-90
  4. Paul A. Kohl
    Pages 91-129
  5. Ning-Cheng Lee
    Pages 199-236
  6. Doug C. H. Yu, Wen-Chih Chiou, Chih Hang Tung
    Pages 237-285
  7. Zhuqing Zhang, Pengli Zhu, C. P. Wong
    Pages 331-371
  8. Hideaki Sasajima, Itaru Watanabe, Makoto Takamoto, Kazuhiko Dakede, Shingo Itoh, Yoshinori Nishitani et al.
    Pages 373-419
  9. Daniel Lu, C. P. Wong
    Pages 421-468
  10. Shinji Takeda, Takashi Masuko, Nozomu Takano, Teiichi Inada
    Pages 469-510
  11. Ravi Prasher, Chia-Pin Chiu
    Pages 511-535
  12. Pulugurtha Markondeya Raj, Dok Won Lee, Liangliang Li, Shan Xiang Wang, Parthasarathi Chakraborti, Himani Sharma et al.
    Pages 537-588
  13. Katsuaki Suganuma, Jinting Jiu
    Pages 589-626
  14. Michael Töpper
    Pages 627-695
  15. Y. C. Lee, Ming Kong, Yadong Zhang
    Pages 697-731
  16. Yu-Chou Shih, Gunwoo Kim, Jiun-Pyng You, Frank G. Shi
    Pages 733-766
  17. Mark Porter, Robert Erich, Mark Ricotta
    Pages 767-811
  18. I-Chun Cheng
    Pages 813-854
  19. Yu-Chou Shih, Frank G. Shi
    Pages 855-877
  20. Xiaodong Zhang, Shi-Wei Ricky Lee, Fuliang Le
    Pages 923-951
  21. Back Matter
    Pages 953-969

About this book


This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including:

  •        Lead-free solders
  •         Flip chip underfills
  •         Epoxy molding compounds
  •         Conductive adhesives
  •         Die attach adhesives/films
  •         Thermal interface materials (TIMS)
  •         Materials for fabricating embedded passives including capacitors, inductors, and resistors
  •         Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS)

Contributors also review new and emerging technologies such as Light Emitting Diode (LED) packaging, as well as packaging for medical devices, flexible and printed electronics, interconnection technologies for solar cells, and nano-metal assisted chemical etching. This book is ideal for professionals in semiconductor fabrication, packaging of electronic and optoelectronic devices and solar cells and medical device packaging areas as well as graduate students studying materials science and engineering or electronic packaging materials and processing.


Microelectronic packaging Adhesives and films Bonding and joining techniques Nanomaterials and nanopackaging Printed electronics MEMS packaging

Editors and affiliations

  • Daniel Lu
    • 1
  • C.P. Wong
    • 2
  1. 1.Henkel China Co., LtdShanghaiChina
  2. 2.Materials Science and EngineeringGeorgia Institute of TechnologyAtlantaUSA

Bibliographic information

  • DOI
  • Copyright Information Springer International Publishing Switzerland 2017
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-45097-1
  • Online ISBN 978-3-319-45098-8
  • Buy this book on publisher's site