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Short-Channel Organic Thin-Film Transistors

Fabrication, Characterization, Modeling and Circuit Demonstration

  • Tarek┬áZaki

Part of the Springer Theses book series (Springer Theses)

Table of contents

  1. Front Matter
    Pages i-xxiii
  2. Tarek Zaki
    Pages 1-4
  3. Tarek Zaki
    Pages 5-31
  4. Tarek Zaki
    Pages 33-56
  5. Tarek Zaki
    Pages 57-81
  6. Tarek Zaki
    Pages 83-95
  7. Tarek Zaki
    Pages 97-113
  8. Tarek Zaki
    Pages 115-138
  9. Tarek Zaki
    Pages 139-169
  10. Tarek Zaki
    Pages 171-175
  11. Back Matter
    Pages 177-220

About this book

Introduction

This work takes advantage of high-resolution silicon stencil masks to build air-stable complementary OTFTs using a low-temperature fabrication process. Plastic electronics based on organic thin-film transistors (OTFTs) pave the way for cheap, flexible and large-area products. Over the past few years, OTFTs have undergone remarkable advances in terms of reliability, performance and scale of integration. Many factors contribute to the allure of this technology; the masks exhibit excellent stiffness and stability, thus allowing OTFTs with submicrometer channel lengths and superb device uniformity to be patterned. Furthermore, the OTFTs employ an ultra-thin gate dielectric that provides a sufficiently high capacitance to enable the transistors to operate at voltages as low as 3 V. The critical challenges in this development are the subtle mechanisms that govern the properties of aggressively scaled OTFTs. These mechanisms, dictated by device physics, are well described and implemented into circuit-design tools to ensure adequate simulation accuracy.

Keywords

Cutoff frequency Device modeling Digital-to-analog converters Flexible electronics Organic integrated circuits Organic thin-film transistors Scattering parameters Silicon stencil masks Small-signal equivalent circuit Static and dynamic characterization

Authors and affiliations

  • Tarek┬áZaki
    • 1
  1. 1.Institute for Microelectronics StuttgartStuttgartGermany

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-18896-6
  • Copyright Information Springer International Publishing Switzerland 2015
  • Publisher Name Springer, Cham
  • eBook Packages Chemistry and Materials Science
  • Print ISBN 978-3-319-18895-9
  • Online ISBN 978-3-319-18896-6
  • Series Print ISSN 2190-5053
  • Series Online ISSN 2190-5061
  • Buy this book on publisher's site