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Three-Dimensional Integration of Semiconductors

Processing, Materials, and Applications

  • Kazuo Kondo
  • Morihiro Kada
  • Kenji Takahashi

Table of contents

  1. Front Matter
    Pages i-xix
  2. Masahiko Tanaka, Makoto Sekine, Itsuko Sakai, Yutaka Kusuda, Tomoyuki Nonaka, Osamu Tsuji et al.
    Pages 43-96
  3. Takashi Haimoto, Eiichi Yamamoto, Takahiko Mitsui, Toshihiro Ito, Tsuyoshi Yoshida, Tsubasa Bandoh et al.
    Pages 97-138
  4. Hiroaki Fusano, Yoshihito Inaba, Toshihisa Nonaka
    Pages 139-165
  5. Gilles Fresquet, Jean-Philippe Piel, Sylvain Perrot, Hideo Takizawa, Osamu Sato, Allen Gu et al.
    Pages 167-200
  6. Hiroshi Takahashi, Senling Wang, Shuichi Kameyama, Yoshinobu Higami, Hiroyuki Yotsuyanagi, Masaki Hashizume et al.
    Pages 235-268
  7. Morihiro Kada, Harufumi Kobayashi, Fumiaki Yamada, Haruo Shimamoto, Shiro Uchiyama, Kenichi Takeda et al.
    Pages 269-400
  8. Back Matter
    Pages 401-408

About this book

Introduction

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Keywords

3D Interconnects 3D Packaging Die Stacking Electrodeposition Semiconductors Through Silicon-vias Wafer Handling

Editors and affiliations

  • Kazuo Kondo
    • 1
  • Morihiro Kada
    • 2
  • Kenji Takahashi
    • 3
  1. 1.Department of Chemical EngineeringOsaka Prefecture UniversityOsakaJapan
  2. 2.AIST Tsukuba, IbarakiJapan
  3. 3.Toshiba CorporationOitaJapan

Bibliographic information