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Molecular Modeling and Multiscaling Issues for Electronic Material Applications

Volume 2

  • Artur Wymyslowski
  • Nancy Iwamoto
  • Matthew Yuen
  • Haibo Fan

Table of contents

  1. Front Matter
    Pages i-x
  2. Xianping Chen, Cell K. Y. Wong, Tianling Ren, Daoguo Yang, Junke Jiang, Qiuhua Liang et al.
    Pages 1-18
  3. Dawid Jan Król, Artur Wymysłowski, Kamil Nouri Allaf
    Pages 67-79
  4. Cell K. Y. Wong, S. Y. Y. Leung, R. H. Poelma, K. M. B. Jansen, C. C. A. Yuan, W. D. van Driel et al.
    Pages 133-148
  5. Sebastian J. Tesarski, Artur Wymysłowski, Kamil Nouri Allaf
    Pages 175-194

About this book

Introduction

This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.

This book also:

Discusses multiscale modeling of materials at the mesoscale

Highlights current state-of-the-art, novel research topics and achievements in the area of molecular modelling and multiscaling problems of electronic materials and their applications as well as atomistic modeling of mechanical properties

Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties

Keywords

Atomistic Scale Electronic Materials Molecular Modeling Multiscale Modeling Quantum Mechanics

Editors and affiliations

  • Artur Wymyslowski
    • 1
  • Nancy Iwamoto
    • 2
  • Matthew Yuen
    • 3
  • Haibo Fan
    • 4
  1. 1.Microsystem Electronics and PhotonicsWroclaw University of TechnologyWroclawPoland
  2. 2.Honeywell Specialty MaterialsSunnyvale CaliforniaUSA
  3. 3.Department of Mechanical EngineeringHong Kong University of Science and TechnologyKowloonHong Kong SAR
  4. 4.Department of Mechanical EngineeringHong Kong University of Science and TechnologyKowloonHong Kong SAR

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-12862-7
  • Copyright Information Springer International Publishing Switzerland 2015
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-12861-0
  • Online ISBN 978-3-319-12862-7
  • Buy this book on publisher's site