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Thermal Transport in Oblique Finned Micro/Minichannels

  • Yan Fan
  • Poh Seng Lee
  • Pawan Kumar Singh
  • Yong Jiun Lee

Part of the SpringerBriefs in Applied Sciences and Technology book series (BRIEFSAPPLSCIENCES)

Also part of the SpringerBriefs in Thermal Engineering and Applied Science book sub series (BRIEFSTHERMAL)

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Yan Fan, Poh Seng Lee, Pawan Kumar Singh, Yong Jiun Lee
    Pages 1-4
  3. Yan Fan, Poh Seng Lee, Pawan Kumar Singh, Yong Jiun Lee
    Pages 5-84
  4. Yan Fan, Poh Seng Lee, Pawan Kumar Singh, Yong Jiun Lee
    Pages 85-125
  5. Yan Fan, Poh Seng Lee, Pawan Kumar Singh, Yong Jiun Lee
    Pages 127-130

About this book

Introduction

The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques  Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies.
Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels.

Keywords

Heat Transfer Enhancement Hotspot Mitigation Micro/minichannel Pressure Drop Penalty Thermal Management

Authors and affiliations

  • Yan Fan
    • 1
  • Poh Seng Lee
    • 2
  • Pawan Kumar Singh
    • 3
  • Yong Jiun Lee
    • 4
  1. 1.National University of SingaporeSingaporeSingapore
  2. 2.National University of SingaporeSingaporeSingapore
  3. 3.National University of SingaporeSingaporeSingapore
  4. 4.National University of SingaporeSingaporeSingapore

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-09647-6
  • Copyright Information The Author(s) 2015
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-09646-9
  • Online ISBN 978-3-319-09647-6
  • Series Print ISSN 2191-530X
  • Series Online ISSN 2191-5318
  • Buy this book on publisher's site