System Reduction for Nanoscale IC Design

  • Peter Benner

Part of the Mathematics in Industry book series (MATHINDUSTRY, volume 20)

Table of contents

  1. Front Matter
    Pages i-xi
  2. Michael Hinze, Martin Kunkel, Ulrich Matthes, Morten Vierling
    Pages 1-37
  3. Andreas Steinbrecher, Tatjana Stykel
    Pages 39-85
  4. Peter Benner, André Schneider
    Pages 87-134
  5. Back Matter
    Pages 195-197

About this book

Introduction

This book describes the computational challenges posed by the progression toward nanoscale electronic devices and increasingly short design cycles in the microelectronics industry, and proposes methods of model reduction which facilitate circuit and device simulation for specific tasks in the design cycle. 

The goal is to develop and compare methods for system reduction in the design of high dimensional nanoelectronic ICs, and to test these methods in the practice of semiconductor development. Six chapters describe the challenges for numerical simulation of nanoelectronic circuits and suggest model reduction methods for constituting equations. These include linear and nonlinear differential equations tailored to circuit equations and drift diffusion equations for semiconductor devices. The performance of these methods is illustrated with numerical experiments using real-world data. Readers will benefit from an up-to-date overview of the latest model reduction methods in computational nanoelectronics.

Keywords

circuit simulation computational nanoelectronics device simulation ​model order reduction nanoelectronics

Editors and affiliations

  • Peter Benner
    • 1
  1. 1.Max Planck Institute for Dynamics of Complex Technical SystemsMagdeburgGermany

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-07236-4
  • Copyright Information Springer International Publishing AG 2017
  • Publisher Name Springer, Cham
  • eBook Packages Mathematics and Statistics
  • Print ISBN 978-3-319-07235-7
  • Online ISBN 978-3-319-07236-4
  • Series Print ISSN 1612-3956
  • Series Online ISSN 2198-3283
  • About this book