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Nanoelectronic Coupled Problems Solutions

  • E. Jan W. ter Maten
  • Hans-Georg Brachtendorf
  • Roland Pulch
  • Wim Schoenmaker
  • Herbert De Gersem
Book

Part of the Mathematics in Industry book series (MATHINDUSTRY, volume 29)

Also part of the The European Consortium for Mathematics in Industry book sub series (TECMI, volume 29)

Table of contents

  1. Front Matter
    Pages i-xxx
  2. Caren Tischendorf, E. Jan W. ter Maten, Wim Schoenmaker
    Pages 1-21
  3. Equations, Discretizations

    1. Front Matter
      Pages 23-24
    2. Wim Schoenmaker, Hans-Georg Brachtendorf, Kai Bittner, Caren Tischendorf, Christian Strohm
      Pages 25-41
    3. David J. Duque Guerra, Thorben Casper, Sebastian Schöps, Herbert De Gersem, Ulrich Römer, Renaud Gillon et al.
      Pages 43-68
    4. Wim Schoenmaker, Hans-Georg Brachtendorf, Kai Bittner, Caren Tischendorf, Christian Strohm
      Pages 69-91
    5. Thorben Casper, David J. Duque Guerra, Sebastian Schöps, Herbert De Gersem
      Pages 93-113
  4. Time Integration for Coupled Problems

    1. Front Matter
      Pages 115-116
    2. Wim Schoenmaker, Hans-Georg Brachtendorf, Kai Bittner, Caren Tischendorf, Christian Strohm
      Pages 117-130
    3. Sebastian Schöps, David J. Duque Guerra, Herbert De Gersem, Andreas Bartel, Michael Günther, Roland Pulch
      Pages 131-159
    4. Kai Bittner, Hans-Georg Brachtendorf
      Pages 161-193
  5. Uncertainty Quantification

    1. Front Matter
      Pages 195-196
    2. Roland Pulch, Piotr Putek, E. Jan W. ter Maten, Wim Schoenmaker
      Pages 197-221
    3. Piotr Putek, E. Jan W. ter Maten, Michael Günther, Andreas Bartel, Roland Pulch, Peter Meuris et al.
      Pages 223-260
    4. Alessandro Di Bucchianico
      Pages 261-278
    5. Roland Pulch, Piotr Putek, Herbert De Gersem, Renaud Gillon
      Pages 279-289
  6. Model Order Reduction

    1. Front Matter
      Pages 291-292
    2. Nicodemus Banagaaya, Lihong Feng, Peter Benner
      Pages 311-328
    3. Yao Yue, Lihong Feng, Peter Benner, Roland Pulch, Sebastian Schöps
      Pages 329-346
  7. Robustness, Reliability, Ageing

    1. Front Matter
      Pages 347-348
    2. E. Jan W. ter Maten, Theo G. J. Beelen, Alessandro Di Bucchianico, Roland Pulch, Ulrich Römer, Herbert De Gersem et al.
      Pages 349-379
    3. Jos J. Dohmen, Bratislav Tasic, Rick Janssen, E. Jan W. ter Maten, Theo G. J. Beelen, Roland Pulch et al.
      Pages 381-400
    4. Jos J. Dohmen, Theo G. J. Beelen, Oryna Dvortsova, E. Jan W. ter Maten, Bratislav Tasić, Rick Janssen
      Pages 401-424
    5. Renaud Gillon, Aarnout Wieers, Frederik Deleu, Tomas Gotthans, Rick Janssen, Wim Schoenmaker et al.
      Pages 425-455
  8. Test Cases, Measurements, Validation and Best Practices

    1. Front Matter
      Pages 457-458
    2. Rick Janssen, Renaud Gillon, Aarnout Wieers, Frederik Deleu, Hervé Guegnaud, Pascal Reynier et al.
      Pages 459-485
    3. Tomas Kratochvil, Jiri Petrzela, Roman Sotner, Jiri Drinovsky, Tomas Gotthans, Aarnout Wieers et al.
      Pages 487-515
    4. Rick Janssen, Renaud Gillon, Aarnout Wieers, Frederik Deleu, Hervé Guegnaud, Pascal Reynier et al.
      Pages 517-563
    5. Renaud Gillon, Aarnout Wieers, Frederik Deleu, Rick Janssen, Wim Schoenmaker, Bart De Smedt et al.
      Pages 565-580
  9. Back Matter
    Pages 581-587

About this book

Introduction

Designs in nanoelectronics often lead to challenging simulation problems and include strong feedback couplings. Industry demands provisions for variability in order to guarantee quality and yield. It also requires the incorporation of higher abstraction levels to allow for system simulation in order to shorten the design cycles, while at the same time preserving accuracy. The methods developed here promote a methodology for circuit-and-system-level modelling and simulation based on best practice rules, which are used to deal with coupled electromagnetic field-circuit-heat problems, as well as coupled electro-thermal-stress problems that emerge in nanoelectronic designs. This book covers:

 (1) advanced monolithic/multirate/co-simulation techniques, which are combined with envelope/wavelet approaches to create efficient and robust simulation techniques for strongly coupled systems that exploit the different dynamics of sub-systems within multiphysics problems, and which allow designers to predict reliability and ageing;

(2) new generalized techniques in Uncertainty Quantification (UQ) for coupled problems to include a variability capability such that robust design and optimization, worst case analysis, and yield estimation with tiny failure probabilities are possible (including large deviations like 6-sigma);

(3) enhanced sparse, parametric Model Order Reduction techniques with a posteriori error estimation for coupled problems and for UQ to reduce the complexity of the sub-systems while ensuring that the operational and coupling parameters can still be varied and that the reduced models offer higher abstraction levels that can be efficiently simulated.

All the new algorithms produced were implemented, transferred and tested by the EDA vendor MAGWEL. Validation was conducted on industrial designs provided by end-users from the semiconductor industry, who shared their feedback, contributed to the measurements, and supplied both material data and process data. In closing, a thorough comparison to measurements on real devices was made in order to demonstrate the algorithms’ industrial applicability.

Keywords

multirate model order reduction co-simulation uncertainty quantification power-MOS devices RF-circuitry bond wires coupled problems multiphysics fault simulation reliability

Editors and affiliations

  • E. Jan W. ter Maten
    • 1
  • Hans-Georg Brachtendorf
    • 2
  • Roland Pulch
    • 3
  • Wim Schoenmaker
    • 4
  • Herbert De Gersem
    • 5
  1. 1.Applied Mathematics & Numerical AnalysisBergische Universität WuppertalWuppertalGermany
  2. 2.Fachhochschule OberösterreichWelsAustria
  3. 3.Institute of Mathematics and Computer ScienceErnst-Moritz Universität GreifswaldGreifswaldGermany
  4. 4.MAGWEL NVLeuvenBelgium
  5. 5.TEMFTU DarmstadtDarmstadtGermany

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-030-30726-4
  • Copyright Information Springer Nature Switzerland AG 2019
  • Publisher Name Springer, Cham
  • eBook Packages Mathematics and Statistics
  • Print ISBN 978-3-030-30725-7
  • Online ISBN 978-3-030-30726-4
  • Series Print ISSN 1612-3956
  • Series Online ISSN 2198-3283
  • Buy this book on publisher's site