A Guide to Lead-free Solders

Physical Metallurgy and Reliability

  • John W. Evans
  • Werner Engelmaier

Table of contents

  1. Front Matter
    Pages i-xiv
  2. Dongil Kwon
    Pages 97-126
  3. Pages 145-185
  4. Jillian Y. Evans
    Pages 187-202
  5. Back Matter
    Pages 203-206

About this book


While tin/lead solders have dominated the electronics industry for many years, environmental considerations and new legislation are forcing change. Backed by more than ten years of research in Pb-free solders, many electronics manufacturers are poised for conversion.

A Guide to Lead-free Solders is intended as a tool to help industry as it moves into a new era in the production and use of solders. An overview of the principles of soldering technology is provided beginning with the theory underlying each concept. Focusing on the most up-to-date methods for testing and characterization, these theories are then reinforced by experimental examples and industrial applications.

• Addresses key issues in assembly from a materials point of view.

• Gives the reader convenient access to data essential for the proper evaluation and employment of cutting-edge ternary Sn/Ag/X solders

• Allows comparison of the performance of Pb-free solders with that of standard eutectic SnPb.

Although primarily of interest to professional design and reliability engineers working in electronics assembly and manufacturing, A Guide to Lead-free Solders will also be valuable for graduate students looking to apply expertise in materials, mechanical or electronic engineering in this industry. Researchers in electronics and materials will find the latest research at their fingertips together with the likely directions industry will need from such research in the future.


Lead Substitutes Metall Solder Alloys Standard architecture cutting design electronics manufacturing materials metal metallurgy microstructure production reliability

Authors and affiliations

  • John W. Evans
    • 1
  1. 1.Silver SpringUSA

Editors and affiliations

  • Werner Engelmaier
    • 1
  1. 1.Ormond BeachUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-84628-310-9
  • Copyright Information Springer-Verlag London Limited 2007
  • Publisher Name Springer, London
  • eBook Packages Engineering
  • Print ISBN 978-1-84628-309-3
  • Online ISBN 978-1-84628-310-9
  • About this book