Thermal Stress and Strain in Microelectronics Packaging

  • John H. Lau

Table of contents

  1. Front Matter
    Pages i-xxiii
  2. An-Yu Kuo, Kuan-Luen Chen
    Pages 139-172
  3. Goran S. Matijasevic, Chen Yu Wang, Chin C. Lee
    Pages 194-220
  4. Michel Mermet-Guyennet
    Pages 410-444
  5. Peter L. Hacke, Arnold F. Sprecher, Hans Conrad
    Pages 467-499
  6. Jim Lynch, Alberto Boetti
    Pages 579-606
  7. Donald B. Barker, Abhijit Dasgupta
    Pages 648-683
  8. John Lau, Ravi Subrahmanyan, Steve Erasmus, Sherman Leung, Che-Yu Li
    Pages 684-728
  9. Michael Pecht, Pradeep Lall
    Pages 729-802
  10. X. Shan, M. Pecht
    Pages 803-849
  11. Back Matter
    Pages 851-883

About this book


Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat­ ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec­ tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.


LSI circuit development electronics growth microelectronics

Editors and affiliations

  • John H. Lau
    • 1
  1. 1.Hewlett-Packard CompanyPalo AltoUSA

Bibliographic information