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© 1999

Microscale Heat Conduction in Integrated Circuits and Their Constituent Films

Book

Part of the Microsystems book series (MICT, volume 6)

Table of contents

  1. Front Matter
    Pages i-xxi
  2. Y. Sungtaek Ju, Kenneth E. Goodson
    Pages 1-8
  3. Y. Sungtaek Ju, Kenneth E. Goodson
    Pages 9-16
  4. Y. Sungtaek Ju, Kenneth E. Goodson
    Pages 17-37
  5. Y. Sungtaek Ju, Kenneth E. Goodson
    Pages 39-58
  6. Y. Sungtaek Ju, Kenneth E. Goodson
    Pages 59-79
  7. Y. Sungtaek Ju, Kenneth E. Goodson
    Pages 81-82
  8. Back Matter
    Pages 89-102

About this book

Keywords

circuit electrical overstress (EOS) integrated circuit interconnect semiconductor transistor

Authors and affiliations

  1. 1.Stanford UniversityUSA

Bibliographic information

  • Book Title Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
  • Authors Y. Sungtaek Ju
    Kenneth E. Goodson
  • Series Title Microsystems
  • DOI https://doi.org/10.1007/978-1-4615-5211-6
  • Copyright Information Springer Science+Business Media New York 1999
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Hardcover ISBN 978-0-7923-8591-2
  • Softcover ISBN 978-1-4613-7374-2
  • eBook ISBN 978-1-4615-5211-6
  • Series ISSN 1389-2134
  • Edition Number 1
  • Number of Pages XXI, 102
  • Number of Illustrations 0 b/w illustrations, 0 illustrations in colour
  • Topics Electrical Engineering
    Optical and Electronic Materials
    Classical Mechanics
  • Buy this book on publisher's site