Microelectronics Packaging Handbook

Technology Drivers Part I

  • Rao R. Tummala
  • Eugene J. Rymaszewski
  • Alan G. Klopfenstein

Table of contents

  1. Front Matter
    Pages i-xxvii
  2. Microelectronics Packaging Handbook: Technology Drivers

    1. Front Matter
      Pages 1-1
    2. Eugene J. Rymaszewski, Rao R. Tummala, Toshihiko Watari
      Pages 3-128
    3. Kenneth Rose, Tsuneyo Chiba, William R. Heller, Wadie F. Mikhail
      Pages 129-198
    4. Evan E. Davidson, George A. Katopis, Toshio Sudo
      Pages 199-313
    5. Robert E. Simons, Vincent W. Antonetti, Wataru Nakayama, Sevgin Oktay
      Pages 314-403
    6. Lewis S. Goldmann, Robert T. Howard, Dexter A. Jeannotte
      Pages 404-555
    7. J. Richard Kraycir, Donald S. Cleverley, Richard F. Levine, Jerry A. Lorenzen
      Pages 556-619
  3. Back Matter
    Pages 621-720

About this book


Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool­ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.


Phase Standard development electronics integrated circuit interconnect manufacturing metal modeling packaging production reliability simulation tables testing

Editors and affiliations

  • Rao R. Tummala
    • 1
  • Eugene J. Rymaszewski
    • 2
  • Alan G. Klopfenstein
    • 3
  1. 1.Georgia Institute of TechnologyUSA
  2. 2.Rensselaer Polytechnic InstituteUSA
  3. 3.AGK EnterprisesUSA

Bibliographic information