Copper Electrodeposition for Nanofabrication of Electronics Devices

  • Kazuo Kondo
  • Rohan N. Akolkar
  • Dale P. Barkey
  • Masayuki Yokoi

Part of the Nanostructure Science and Technology book series (NST)

Table of contents

  1. Front Matter
    Pages i-viii
  2. Copper Electrodepositon and Additive Chemistry

    1. Front Matter
      Pages 1-1
    2. Masayuki Yokoi
      Pages 3-25
    3. Masayuki Yokoi
      Pages 27-43
    4. Dale P. Barkey
      Pages 45-61
    5. Yutaka Kaneko
      Pages 63-95
  3. Copper on Chip Metallization

    1. Front Matter
      Pages 97-97
    2. James Kelly, Christopher Parks, James Demarest, Juntao Li, Christopher Penny
      Pages 115-130
    3. Aleksandar Radisic, Philippe M. Vereecken
      Pages 131-173
  4. Through Silicon Via and Other Methods

    1. Front Matter
      Pages 171-171
    2. Kazuo Kondo
      Pages 177-192
    3. Kiyoshi Takagi, Toshikazu Okubo
      Pages 193-227
    4. Akitoshi Suzuki, Jun Shinozaki
      Pages 229-265
    5. Wei-Ping Dow
      Pages 267-282
  5. Dale P. Barkey
    Pages E1-E1

About this book

Introduction

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as:

• ULSI wiring material based upon copper nanowiring
• Printed circuit boards
• Stacked semiconductors
• Through Silicon Via
• Smooth copper foil for Lithium-Ion battery electrodes

This book is ideal for nanotechnologists, industry professionals, and practitioners.

Keywords

Additive Chemistry Copper Electrodeposition Metallization Nanofabrication Printed Circuit Board Through Silicon Via ULSI Interconnect

Editors and affiliations

  • Kazuo Kondo
    • 1
  • Rohan N. Akolkar
    • 2
  • Dale P. Barkey
    • 3
  • Masayuki Yokoi
    • 4
  1. 1.Dept. of Chemical EngineeringOsaka Prefecture UniversityOsakaJapan
  2. 2.Intel CorporationHillsboroUSA
  3. 3.Dept. of Chemical EngineeringUniversity of New HampshireDurhamUSA
  4. 4.Industrial Technology Support InstituteOsaka PrefectureJapan

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-9176-7
  • Copyright Information Springer Science+Business Media New York 2014
  • Publisher Name Springer, New York, NY
  • eBook Packages Chemistry and Materials Science
  • Print ISBN 978-1-4614-9175-0
  • Online ISBN 978-1-4614-9176-7
  • Series Print ISSN 1571-5744
  • Series Online ISSN 2197-7976
  • About this book