Embedded Memory Design for Multi-Core and Systems on Chip

  • Baker Mohammad

Part of the Analog Circuits and Signal Processing book series (ACSP, volume 116)

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Baker Mohammad
    Pages 1-11
  3. Baker Mohammad
    Pages 13-28
  4. Baker Mohammad
    Pages 29-35
  5. Baker Mohammad
    Pages 37-52
  6. Baker Mohammad
    Pages 53-59
  7. Baker Mohammad
    Pages 61-68
  8. Baker Mohammad
    Pages 69-74
  9. Back Matter
    Pages 91-95

About this book


This book describes the various tradeoffs systems designers face when designing embedded memory.  Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test.  The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.

 ·         Provides a comprehensive overview of embedded memory design and associated challenges and choices;

·         Explains tradeoffs and dependencies across different disciplines involved with multi-core and system on chip memory design;

·         Includes detailed discussion of memory hierarchy and its impact on energy and performance;

·         Uses real product examples to demonstrate embedded memory design flow from architecture, to circuit design, design for test and yield analysis.


Analog Circuits and Signal Processing Cache Memory Embedded Memory Architecture Embedded Memory Design Embedded Memory Hierarchy Low-power Memory Design Memory Circuit Design Memory Design for Test Multicore Memory Design System-on-Chip Memory Design

Authors and affiliations

  • Baker Mohammad
    • 1
  1. 1.Khalifa University of Science, Technology and ResearchAbu DhabiUtd.Arab.Emir.

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-8881-1
  • Copyright Information Springer Science+Business Media New York 2014
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-8880-4
  • Online ISBN 978-1-4614-8881-1
  • Series Print ISSN 1872-082X
  • Series Online ISSN 2197-1854
  • About this book