Nanofins

Science and Applications

  • Navdeep Singh
  • Debjyoti Banerjee

Part of the SpringerBriefs in Applied Sciences and Technology book series (BRIEFSAPPLSCIENCES)

Also part of the SpringerBriefs in Thermal Engineering and Applied Science book sub series (BRIEFSTHERMAL)

Table of contents

  1. Front Matter
    Pages i-xii
  2. Navdeep Singh, Debjyoti Banerjee
    Pages 1-21
  3. Navdeep Singh, Debjyoti Banerjee
    Pages 23-50
  4. Navdeep Singh, Debjyoti Banerjee
    Pages 51-64
  5. Navdeep Singh, Debjyoti Banerjee
    Pages 65-70

About this book

Introduction

Nanofins Science and Technology describes the heat transfer effectiveness of polymer coolants and their fundamental interactions with carbon nanotube coatings that act as nanofins. Heat transfer at micro/nano-scales has attracted significant attention in contemporary literature. This has been primarily driven by industrial requirements where significant decrease in the size of electronic devices/chips with concomitant enhancement in the heat flux have caused challenging needs for cooling of these platforms. With quantum effects kicking in, traditional cooling techniques need to be replaced with more effective technologies. A promising technique is to enhance heat transfer by surface texturing using nanoparticle coatings or engineered nanostructures. These nanostructures are termed as nanofins because they augment heat transfer by a combination of surface area enhancement as well as liquid-solid interactions at the molecular scale.

Keywords

Carbon Nanotubes Energy Transfer Mechanisms Heat Transfer Interfacial Thermal Resistance Kaptiza Resistance Molecular Dynamics Molecular Dynamics Simulations Nanofins Nanotubes Simulate Heat Transfer

Authors and affiliations

  • Navdeep Singh
    • 1
  • Debjyoti Banerjee
    • 2
  1. 1.Department of Mechanical EngineeringTexas A&M UniversityCollege StationUSA
  2. 2.Department of Mechanical EngineeringTexas A&M UniversityCollege StationUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-8532-2
  • Copyright Information The Author(s) 2014
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-8531-5
  • Online ISBN 978-1-4614-8532-2
  • Series Print ISSN 2191-530X
  • Series Online ISSN 2191-5318
  • About this book