Correct-by-Construction Approaches for SoC Design

  • Roopak Sinha
  • Parthasarathi Roop
  • Samik Basu

Table of contents

  1. Front Matter
    Pages i-xxi
  2. Roopak Sinha, Parthasarathi Roop, Samik Basu
    Pages 1-10
  3. Roopak Sinha, Parthasarathi Roop, Samik Basu
    Pages 11-23
  4. Roopak Sinha, Parthasarathi Roop, Samik Basu
    Pages 25-54
  5. Roopak Sinha, Parthasarathi Roop, Samik Basu
    Pages 55-72
  6. Roopak Sinha, Parthasarathi Roop, Samik Basu
    Pages 73-85
  7. Roopak Sinha, Parthasarathi Roop, Samik Basu
    Pages 87-106
  8. Roopak Sinha, Parthasarathi Roop, Samik Basu
    Pages 107-119
  9. Back Matter
    Pages 121-144

About this book

Introduction

This book describes an approach for designing Systems-on-Chip such that the system meets precise mathematical requirements. The methodologies presented enable embedded systems designers to reuse intellectual property (IP) blocks from existing designs in an efficient, reliable manner, automatically generating correct SoCs from multiple, possibly mismatching, components.

·         Provides a single-source reference to correct-by-construction SoC design;

·         Enables optimized design cycles, with techniques to reuse IP blocks reliably;

·         Uses realistic SoC case studies to highlight the concepts introduced; 

·         Demonstrates techniques using industrial standard SoC frameworks such as ARM AMBA.

Keywords

Correct-by-construction Design Embedded Systems Design Formal Methods Formal Verification Reuse Methodology SoC System-level verification System-on-Chip System-on-Chip Verification

Authors and affiliations

  • Roopak Sinha
    • 1
  • Parthasarathi Roop
    • 2
  • Samik Basu
    • 3
  1. 1.Electrical and Computer EngineeringThe University of AucklandAucklandNew Zealand
  2. 2.Electrical and Computer EngineeringThe University of AucklandAucklandNew Zealand
  3. 3.Department of Computer ScienceIowa State UniversityAmesUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-7864-5
  • Copyright Information Springer Science+Business Media New York 2014
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-7863-8
  • Online ISBN 978-1-4614-7864-5
  • About this book