Mechanical Self-Assembly

Science and Applications

  • Xi Chen

Table of contents

  1. Front Matter
    Pages i-x
  2. Xi Chen, Jie Yin
    Pages 1-8
  3. Xi Chen, Jie Yin
    Pages 9-23
  4. Myoung-Woon Moon, Chansoo Kim, Ashkan Vaziri
    Pages 47-67
  5. Wei Hong, Fangliang Gao
    Pages 111-130
  6. Myoung-Woon Moon
    Pages 131-152
  7. Alex A. Volinsky, Patrick Waters
    Pages 153-170
  8. Xi Chen, Jie Yin
    Pages 171-199
  9. Back Matter
    Pages 201-206

About this book

Introduction

Mechanical Self-Assembly: Science and Applications introduces a novel category of self-assembly driven by mechanical forces. This book discusses self-assembly in various types of small material structures including thin films, surfaces, and micro- and nano-wires, as well as the practice's potential application in micro and nanoelectronics, MEMS/NEMS, and biomedical engineering. The mechanical self-assembly process is inherently quick, simple, and cost-effective, as well as accessible to a large number of materials, such as curved surfaces for forming three-dimensional small structures. Mechanical self-assembly is complementary to, and sometimes offer advantages over, the traditional micro- and nano-fabrication.

This book also:

Presents a highly original aspect of the science of self-assembly

Describes the novel methods of mechanical assembly used to fabricate a variety of new three-dimensional material structures in simple and cost-effective ways

Provides simple insights to a number of biological systems and processes

Elucidates underlying mechanics principles of spontaneous pattern formations

Mechanical Self-Assembly: Science and Applications is an ideal book for graduate students and engineers involved in the field of mechanical self-assembly.

 

 

Keywords

3D fabrication Biomimetics Capillary wrinkling Fabrication methods Flexible electronics MEMS Mechanical self-assembly Microelectronics Nanofabrication Self-assembly

Editors and affiliations

  • Xi Chen
    • 1
  1. 1., Dept. of Earth and Environmental Eng.Columbia UniversityNew YorkUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-4562-3
  • Copyright Information Springer Science+Business Media New York 2013
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-4561-6
  • Online ISBN 978-1-4614-4562-3
  • About this book