Transient and Permanent Error Control for Networks-on-Chip

  • Qiaoyan Yu
  • Paul Ampadu

Table of contents

  1. Front Matter
    Pages i-xii
  2. Qiaoyan Yu, Paul Ampadu
    Pages 1-17
  3. Qiaoyan Yu, Paul Ampadu
    Pages 19-35
  4. Qiaoyan Yu, Paul Ampadu
    Pages 37-63
  5. Qiaoyan Yu, Paul Ampadu
    Pages 65-79
  6. Qiaoyan Yu, Paul Ampadu
    Pages 81-116
  7. Qiaoyan Yu, Paul Ampadu
    Pages 151-155
  8. Back Matter
    Pages 157-159

About this book


This book addresses reliability and energy efficiency of on-chip networks using a configurable error control coding (ECC) scheme for datalink-layer transient error management. The method can adjust both error detection and correction strengths at runtime by varying the number of redundant wires for parity-check bits. Methods are also presented to tackle joint transient and permanent error correction, exploiting the redundant resources already available on-chip. A parallel and flexible network simulator is also introduced, which facilitates examining the impact of various error control methods on network-on-chip performance.

  • Includes a complete survey of error control methods for reliable networks-on-chip, evaluated for reliability, energy and performance metrics;
  • Provides analysis of error control in various network-on-chip layers, as well as presentation of an innovative multi-layer error control coding technique;
  • Presents state-of-the-art solutions to address simultaneously reliability, energy and performance;
  • Describes configurable error management solutions and their hardware implementation details for variable noise conditions;
  • Provides details of a flexible and parallel NoC simulator and corresponding simulation setup to achieve the reported results.



Embedded Systems Error Control in Network on Chip Integrated Circuit Design Network on Chip On-chip interconnect Reliability in Networks on Chip Transient Errors

Authors and affiliations

  • Qiaoyan Yu
    • 1
  • Paul Ampadu
    • 2
  1. 1.University of New HampshireDurhamUSA
  2. 2.University of RochesterRochesterUSA

Bibliographic information

  • DOI
  • Copyright Information Springer Science+Business Media, LLC 2012
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-0961-8
  • Online ISBN 978-1-4614-0962-5
  • Buy this book on publisher's site