3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics

  • Simon Li
  • Yue Fu

Table of contents

  1. Front Matter
    Pages i-xiv
  2. Simon Li, Yue Fu
    Pages 1-17
  3. Simon Li, Yue Fu
    Pages 19-39
  4. Simon Li, Yue Fu
    Pages 41-80
  5. Simon Li, Yue Fu
    Pages 81-104
  6. Simon Li, Yue Fu
    Pages 105-133
  7. Simon Li, Yue Fu
    Pages 135-186
  8. Simon Li, Yue Fu
    Pages 237-249
  9. Simon Li, Yue Fu
    Pages 251-272
  10. Simon Li, Yue Fu
    Pages 273-282
  11. Back Matter
    Pages 283-292

About this book

Introduction

Technology computer-aided design, or TCAD, is critical to today’s semiconductor technology and anybody working in this industry needs to know something about TCAD.  This book is about how to use computer software to manufacture and test virtually semiconductor devices in 3D.  It brings to life the topic of semiconductor device physics, with a hands-on, tutorial approach that de-emphasizes abstract physics and equations and emphasizes real practice and extensive illustrations.  Coverage includes a comprehensive library of devices, representing the state of the art technology, such as SuperJunction LDMOS, GaN LED devices, etc.

  • Provides a vivid, internal view of semiconductor devices, through 3D TCAD simulation;
  • Includes comprehensive coverage of  TCAD simulations for both optic and electronic devices, from nano-scale to high-voltage high-power devices;
  • Presents material in a hands-on, tutorial fashion so that industry practitioners will find maximum utility;
  • Includes a comprehensive library of devices, representing the state of the art technology, such as SuperJunction LDMOS, GaN LED devices, etc.  
     

Keywords

3D TCAD Integrated Circuits Semiconductor Device Simulation Semiconductor Devices Semiconductor Manufacturing Semiconductor Processes TCAD Technology Computer Aided Design

Authors and affiliations

  • Simon Li
    • 1
  • Yue Fu
    • 2
  1. 1.Crosslight Software, Inc.BurnabyCanada
  2. 2.Crosslight Software, Inc.BurnabyCanada

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-0481-1
  • Copyright Information Springer Science+Business Media, LLC 2012
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-0480-4
  • Online ISBN 978-1-4614-0481-1
  • About this book