Ultra High-Speed CMOS Circuits

Beyond 100 GHz

  • Sam Gharavi
  • Babak Heydari

Table of contents

  1. Front Matter
    Pages i-vii
  2. Sam Gharavi, Babak Heydari
    Pages 1-4
  3. Sam Gharavi, Babak Heydari
    Pages 5-21
  4. Sam Gharavi, Babak Heydari
    Pages 23-34
  5. Sam Gharavi, Babak Heydari
    Pages 35-45
  6. Sam Gharavi, Babak Heydari
    Pages 47-58
  7. Sam Gharavi, Frank Chang
    Pages 59-80
  8. Sam Gharavi, Frank Chang, Mohammed H. Gharavi
    Pages 81-104
  9. Back Matter
    Pages 105-106

About this book

Introduction

The book covers the CMOS-based millimeter wave circuits and devices and presents methods and design techniques to use CMOS technology for circuits operating beyond 100 GHz.� Coverage includes a detailed description of both active and passive devices, including modeling techniques and performance optimization. Various mm-wave circuit blocks are discussed, emphasizing their design distinctions from low-frequency design methodologies. This book also covers a device-oriented circuit design technique that is essential for ultra high speed circuits and gives some examples of device/circuit co-design that can be used for mm-wave technology.

  • Offers a detailed description of high frequency device modeling from a circuit designer perspective;
  • Presents a set of techniques for optimizing the performance of CMOS for mm-wave technology, including noise and low noise design for mm-wave;
  • Introduces circuit/device co-design techniques.

Keywords

CMOS Technology CMOS-based millimeter wave circuits Embedded Systems High frequency device modeling Integrated circuit design Solid State circuit design Ultra High-Speed CMOS Circuits mm-wave Devices

Authors and affiliations

  • Sam Gharavi
    • 1
  • Babak Heydari
    • 2
  1. 1., Electrical Engineering DepartmentUniversity of California, Los AngelesLos AngelesUSA
  2. 2.Stevens Institute of TechnologyHobokenUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-0305-0
  • Copyright Information Springer Science+Business Media, LLC 2012
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-0304-3
  • Online ISBN 978-1-4614-0305-0
  • About this book