Thermomechanics and Infra-Red Imaging, Volume 7

Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics

  • Tom Proulx

Table of contents

  1. Front Matter
    Pages i-viii
  2. D. A. Crump, J. M. Dulieu-Barton, R. K. Fruehmann
    Pages 1-7
  3. R K Fruehmann, D A Crump, J M Dulieu-Barton
    Pages 9-15
  4. T. Chan, D. Backman, R. Bos, T. Sears, I. Brooks, U. Erb
    Pages 17-23
  5. B. Wattrisse, R. Caborgan, J.-M. Muracciole, L. Sabatier, A. Chrysochoos
    Pages 25-31
  6. Thomas Pottier, Franck Toussaint, Hervé Louche, Pierre Vacher
    Pages 33-37
  7. A. Chrysochoos, A. Blanche, B. Berthel, B. Wattrisse
    Pages 39-49
  8. S T Taher, O T Thomsen, J M Dulieu-Barton
    Pages 67-74
  9. Bradley G. Bainbridge, Yicheng “Peter” Pan, Tsuchin “Philip” Chu
    Pages 75-82
  10. R K Fruehmann, J M Dulieu-Barton, O T Thomsen, S Zhang
    Pages 83-90
  11. Takahide Sakagami, Yui Izumi, Shiro Kubo
    Pages 99-106
  12. A. F. Robinson, J. M. Dulieu-Barton, S. Quinn, R. L. Burguete
    Pages 107-115
  13. Rachel A Tomlinson, Eann A Patterson
    Pages 123-129

About these proceedings

Introduction

Thermomechanics and Infra-Red Imaging represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference & Exposition on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011.� The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, MEMS and Nanotechnology; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, and Engineering Applications of Residual Stress.

Authors and affiliations

  • Tom Proulx
    • 1
  1. 1.Society for Experimental MechanicsBETHELUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-0207-7
  • Copyright Information The Society for Experimental Mechanics, Inc. 2011 2011
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-0206-0
  • Online ISBN 978-1-4614-0207-7
  • Series Print ISSN 2191-5644
  • Series Online ISSN 2191-5652
  • About this book