Adhesion Aspects of Polymeric Coatings

  • K. L. Mittal
Book

Table of contents

  1. Front Matter
    Pages i-xii
  2. General Overviews

  3. Factors Influencing Adhesion

  4. Bond Durability

    1. Front Matter
      Pages 263-263
    2. Walter Brockmann
      Pages 265-280
    3. J. S. Ahearn, G. D. Davis, T. S. Sun, J. D. Venables
      Pages 281-299

About this book

Introduction

This volume chronicles the proceedings of the Symposium on Adhesion Aspects of Polymeric Coatings held under the auspices of the Electrochemical Society in Minneapolis, MN, May 10-15, 1981. This event was cosponsored by the Dielectric and Insulation, and Electrothermics and Metallurgy Divisions. Polymeric coatings are used for a number of purposes, e. g. , decorative, protective, functional (as dielectrics or insulators) and a special application of polymeric (organic) coatings is their use as lithographic materials for making integrated circuit elements. Irrespective of the purpose of the coating, it must adhere well to the underlying substrate. So the need to under­ stand the factors which influence adhesion of organic coatings and the ways to attain desired adhesion is quite manifest. This Symposium was designed to bring together scientists and technologists interested in the adhesion aspects of polymeric coatings, to provide a forum for discussion of latest findings, and to provide an opportunity for cross-pollination of ideas. The technical program contained a total of 46 papers by authors from various corners of the world. The program comprised both invited overviews and contributed original research papers, as this blend is the best way to present the state of knowledge of a topic. The invited speakers were selected so as to represent widely differ­ ing disciplines and interests and they hailed from various aca­ demic and industrial research laboratories.

Keywords

adhesion bonding electrolyte influence ketone metallurgy metals paper pollination polymer society spectroscopy structure

Editors and affiliations

  • K. L. Mittal
    • 1
  1. 1.East Fishkill FacilityIBM CorporationHopewell JunctionUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4613-3658-7
  • Copyright Information Springer-Verlag US 1983
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-1-4613-3660-0
  • Online ISBN 978-1-4613-3658-7
  • About this book