Thermal Contact Conductance

  • C. V. Madhusudana

Part of the Mechanical Engineering Series book series (MES)

Table of contents

  1. Front Matter
    Pages i-xvi
  2. C. V. Madhusudana
    Pages 1-8
  3. C. V. Madhusudana
    Pages 9-22
  4. C. V. Madhusudana
    Pages 23-43
  5. C. V. Madhusudana
    Pages 45-63
  6. C. V. Madhusudana
    Pages 65-76
  7. C. V. Madhusudana
    Pages 101-150
  8. C. V. Madhusudana
    Pages 151-156
  9. Back Matter
    Pages 157-167

About this book


Heat transfer between two bodies in thermal contact is of fundamental importance in a wide variety of applications ranging from industrial and domestic processes to fundamental biology and chemistry. This book covers both the theoretical and practical aspects of thermal contact conductance. The theoretical discussion covers heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data for use in designing heat-transfer equipment for a variety of joints, including special geometries and configurations.


design flow heat transfer material mechanism metals plasticity

Authors and affiliations

  • C. V. Madhusudana
    • 1
  1. 1.School of Mechanical and Manufacturing EngineeringUniversity of New South WalesSydneyAustralia

Bibliographic information

  • DOI
  • Copyright Information Springer-Verlag New York 1996
  • Publisher Name Springer, New York, NY
  • eBook Packages Springer Book Archive
  • Print ISBN 978-1-4612-8457-4
  • Online ISBN 978-1-4612-3978-9
  • Series Print ISSN 0941-5122
  • Series Online ISSN 2192-063X
  • Buy this book on publisher's site