Interfacial Compatibility in Microelectronics

Moving Away from the Trial and Error Approach

  • Tomi Laurila
  • Vesa Vuorinen
  • Mervi Paulasto-Kröckel
  • Markus Turunen
  • Toni T. Mattila
  • Jorma Kivilahti

Part of the Microsystems book series (MICT)

Table of contents

  1. Front Matter
    Pages i-ix
  2. Tomi Laurila, Vesa Vuorinen, Toni T. Mattila, Markus Turunen, Mervi Paulasto-Kröckel, Jorma K. Kivilahti
    Pages 1-5
  3. Tomi Laurila, Vesa Vuorinen, Toni T. Mattila, Markus Turunen, Mervi Paulasto-Kröckel, Jorma K. Kivilahti
    Pages 7-23
  4. Tomi Laurila, Vesa Vuorinen, Toni T. Mattila, Markus Turunen, Mervi Paulasto-Kröckel, Jorma K. Kivilahti
    Pages 25-43
  5. Tomi Laurila, Vesa Vuorinen, Toni T. Mattila, Markus Turunen, Mervi Paulasto-Kröckel, Jorma K. Kivilahti
    Pages 45-100
  6. Tomi Laurila, Vesa Vuorinen, Toni T. Mattila, Markus Turunen, Mervi Paulasto-Kröckel, Jorma K. Kivilahti
    Pages 101-133
  7. Tomi Laurila, Vesa Vuorinen, Toni T. Mattila, Markus Turunen, Mervi Paulasto-Kröckel, Jorma K. Kivilahti
    Pages 135-211
  8. Back Matter
    Pages 213-217

About this book

Introduction

Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.

In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes:

•solutions to several common reliability issues in microsystem technology,

•methods to understand and predict failure mechanisms at interfaces between dissimilar materials and

•an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.

Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.

 

 

Keywords

Chemical thermodynamics Design for reliability Materials compatibility Microsystem packaging

Authors and affiliations

  • Tomi Laurila
    • 1
  • Vesa Vuorinen
    • 2
  • Mervi Paulasto-Kröckel
    • 3
  • Markus Turunen
    • 4
  • Toni T. Mattila
    • 5
  • Jorma Kivilahti
    • 6
  1. 1.School of Science and Technology, Faculty of ElectronicsAalto UniversityEspooFinland
  2. 2.School of Science and Technology, Faculty of ElectronicsAalto UniversityEspooFinland
  3. 3.School of Science and Technology, Department of ElectronicsAalto UniversityEspooFinland
  4. 4., Faculty of ElectronicsAalto University School of Science and TEspooFinland
  5. 5.Technology, Faculty of ElectronicsAalto University School of Science andEspooFinland
  6. 6., Faculty of ElectronicsAalto University School of Science and TEspooFinland

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4471-2470-2
  • Copyright Information Springer-Verlag London 2012
  • Publisher Name Springer, London
  • eBook Packages Engineering
  • Print ISBN 978-1-4471-2469-6
  • Online ISBN 978-1-4471-2470-2
  • Series Print ISSN 1389-2134
  • About this book