Introduction to Biosensors

From Electric Circuits to Immunosensors

  • Jeong-Yeol Yoon

Table of contents

  1. Front Matter
    Pages i-xii
  2. Jeong-Yeol Yoon
    Pages 1-14
  3. Jeong-Yeol Yoon
    Pages 15-37
  4. Jeong-Yeol Yoon
    Pages 39-57
  5. Jeong-Yeol Yoon
    Pages 59-73
  6. Jeong-Yeol Yoon
    Pages 75-86
  7. Jeong-Yeol Yoon
    Pages 87-101
  8. Jeong-Yeol Yoon
    Pages 103-119
  9. Jeong-Yeol Yoon
    Pages 121-139
  10. Jeong-Yeol Yoon
    Pages 141-160
  11. Jeong-Yeol Yoon
    Pages 161-180
  12. Jeong-Yeol Yoon
    Pages 181-198
  13. Jeong-Yeol Yoon
    Pages 199-223
  14. Jeong-Yeol Yoon
    Pages 225-256
  15. Back Matter
    Pages 257-262

About this book


Introduction to Biosensors: From Electric Circuits to Immunosensors discusses underlying circuitry of sensors for biomedical and biological engineers as well as biomedical sensing modalities for electrical engineers while providing an applications-based approach to the study of biosensors with over 13 extensive, hands-on labs. The material is presented using a building-block approach, beginning with the fundamentals of sensor design and temperature sensors and ending with more complicated biosensors. This book also:

Provides electrical engineers with the specific knowledge they need to understand biological sensing modalities

Provides biomedical engineers with a solid background in circuits and systems

Includes complete coverage of temperature sensors, electrochemical sensors, DNA and immunosensors, piezoelectric sensors and immunosensing in a micofluidic device

Introduction to Biosensors: From Electric Circuits to Immunosensors aims to provide an interdisciplinary approach to biosensors that will be appreciated by biomedical, biological, and electrical engineers.


biochips biosensors electric circuits immunosensors optoelectronics sensor design temperature sensors

Authors and affiliations

  • Jeong-Yeol Yoon
    • 1
  1. 1.Dept. Agricultural & Biosystems Engin.University of ArizonaTucsonUSA

Bibliographic information

  • DOI
  • Copyright Information Springer Science+Business Media New York 2013
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-6021-4
  • Online ISBN 978-1-4419-6022-1
  • Buy this book on publisher's site