Advanced Flip Chip Packaging

  • Ho-Ming Tong
  • Yi-Shao Lai
  • C.P. Wong

Table of contents

  1. Front Matter
    Pages i-vii
  2. Robert Lanzone
    Pages 1-21
  3. Eric Perfecto, Kamalesh Srivastava
    Pages 23-52
  4. Michael Töpper, Daniel Lu
    Pages 53-84
  5. Sung-Kwon Kang, Da-Yuan Shih, William E. Bernier
    Pages 85-154
  6. Zhuqing Zhang, Shijian Luo, C. P. Wong
    Pages 155-199
  7. Daoqiang Daniel Lu, C. P. Wong
    Pages 201-261
  8. Yutaka Tsukada
    Pages 263-339
  9. Yiyu Shi, Yang Shang, Hao Yu, Shauki Elassaad
    Pages 341-412
  10. Richard C. Chu, Robert E. Simons, Madhusudan Iyengar, Lian-Tuu Yeh
    Pages 413-469
  11. Li Li, Hongtao Ma
    Pages 471-501
  12. C. E. Ho, C. R. Kao, K. N. Tu
    Pages 503-560

About this book

Introduction

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

This book also:

  • Offers broad-ranging chapters with a focus on IC-package-system integration
  • Provides viewpoints from leading industry executives and experts
  • Details state-of-the-art achievements in process technologies and scientific research
  • Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information

Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

Keywords

Assembly Technologies Bumping Technology Electrical and Thermal Design Electromigration Flip Chip Packaging IC Packaging IC-Package-System-Integration Substrate Packaging Thermomechanical Reliability Thermomigration

Editors and affiliations

  • Ho-Ming Tong
    • 1
  • Yi-Shao Lai
    • 2
  • C.P. Wong
    • 3
  1. 1.ASE GroupKaohsiungTaiwan R.O.C.
  2. 2.ASE GroupKaohsiungTaiwan R.O.C.
  3. 3., Department of EngineeringThe Chinese University of Hong KongHong Kong, SARChina, People's Republic

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-5768-9
  • Copyright Information Springer Science+Business Media New York 2013
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-5767-2
  • Online ISBN 978-1-4419-5768-9
  • About this book