Reliability of Microtechnology

Interconnects, Devices and Systems

  • Johan Liu
  • Olli Salmela
  • Jussi Sarkka
  • James E. Morris
  • Per-Erik Tegehall
  • Cristina Andersson

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 1-2
  3. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 3-34
  4. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 35-48
  5. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 49-69
  6. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 71-98
  7. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 99-113
  8. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 115-122
  9. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 123-131
  10. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 133-148
  11. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 149-168
  12. Johan Liu, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, Cristina Andersson
    Pages 169-180
  13. Back Matter
    Pages 181-204

About this book

Introduction

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also:

  • Discusses the general failure mechanisms of microsystems on a component level
  • Offers comprehensive coverage of solder joint reliability at the microsystems level
  • Analyzes�quality issues and manufacturing at the microsystems level

Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter.

Keywords

Electrical conductive adhesives Failure mechanisms of microsystems Interconnection reliability Microsystems Reliability for manufacturability Reliability metrology Reliability of microsystems Solder joints System level reliability Thermal fatigue

Authors and affiliations

  • Johan Liu
    • 1
  • Olli Salmela
    • 2
  • Jussi Sarkka
    • 3
  • James E. Morris
    • 4
  • Per-Erik Tegehall
    • 5
  • Cristina Andersson
    • 6
  1. 1.Dept. Microtechnology & NanoscienceChalmers University of TechnologyGöteborgSweden
  2. 2.EspooFinland
  3. 3.Nokia Siemens NetworksOuluFinland
  4. 4.Dept. Electrical &, Computer EngineeringPortland State UniversityPortlandUSA
  5. 5.Swedish Ceramic InstituteSwerea IVFMölndalSweden
  6. 6., Department of Microtechnology and NanoscChalmers University of TechnologyGöteborgSweden

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-5760-3
  • Copyright Information Springer Science+Business Media, LLC 2011
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-5759-7
  • Online ISBN 978-1-4419-5760-3
  • About this book