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Moisture Sensitivity of Plastic Packages of IC Devices

  • X.J. Fan
  • E. Suhir

Table of contents

  1. Front Matter
    Pages i-xvii
  2. E. Stellrecht, B. Han, M. Pecht
    Pages 113-130
  3. X.J. Fan, J. Zhou, G.Q. Zhang, A. Chandra
    Pages 279-299
  4. M.S. Zhang, S.W.R. Lee, X.J. Fan
    Pages 389-409
  5. W.D. van Driel, D.G. Yang, C.A. Yuan, G.Q. Zhang
    Pages 411-434
  6. X.J. Fan, T.Y. Tee, C.Q. Cui, G.Q. Zhang
    Pages 435-460
  7. Back Matter
    Pages 551-570

About this book

Introduction

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: • Thorough exploration of moisture’s effects based on lectures and tutorials by the authors • Consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging • Emerging theories and cutting-edge industrial applications presented by the leading professionals in the field Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Keywords

development devices dynamics integrated circuit mechanics microelectromechanical system (MEMS) microelectronic microsystem microsystems modeling packaging reliability simulation technology transport

Editors and affiliations

  • X.J. Fan
    • 1
  • E. Suhir
    • 2
  1. 1.Dept. Mechanical EngineeringLamar UniversityBeaumontUSA
  2. 2.ERS Co.Los AltosUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-5719-1
  • Copyright Information Springer Science+Business Media, LLC 2010
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-5718-4
  • Online ISBN 978-1-4419-5719-1
  • Buy this book on publisher's site